ATS-01F-04-C2-R0 Allicdata Electronics
Allicdata Part #:

ATS3634-ND

Manufacturer Part#:

ATS-01F-04-C2-R0

Price: $ 3.86
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 40X40X20MM XCUT T766
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-01F-04-C2-R0 datasheetATS-01F-04-C2-R0 Datasheet/PDF
Quantity: 1000
1 +: $ 3.50280
10 +: $ 3.41208
25 +: $ 3.31960
50 +: $ 3.13526
100 +: $ 2.95079
250 +: $ 2.76641
500 +: $ 2.67419
1000 +: $ 2.39754
Stock 1000Can Ship Immediately
$ 3.86
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.575" (40.00mm)
Width: 1.575" (40.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.790" (20.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 11.58°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management has become vitally important in the modern world, as the use of electronic devices has grown exponentially and is now integral to nearly every aspect of our lives. Heat sinks are essential components in the effort to effectively regulate the temperatures of electrical components, and the ATS-01F-04-C2-R0 is among the most popular choices in heat sink engineering.

The ATS-01F-04-C2-R0 is a finned aluminum heat sink designed to fit a variety of electronic components. It is composed of a number of finned aluminum sheets which are sandwiched together, creating a single stack of the fins which provides maximum contact with air surrounding the device. This formation helps to disperse heat generated by the device and prevent it from being concentrated in any one area. Each fin is designed and carved in a way that optimizes air circulation, as well as the use of a cold plate at the bottom of the heat sink helps to further dissipate the heat. Heat is also conducted away from the device through the use of multiple thermal pads mounted to the fins, as these pads absorb the heat and spread it away from the device.

The ATS-01F-04-C2-R0 is used primarily to protect electrical components from overheating, and it is used in a wide variety of applications. Its finned heat sinks can be used in computers, gaming systems, telecommunications equipment, home appliances, and many other electronic devices. Its finned aluminum construction lends itself to a wide range of uses, both for cooling components and protecting devices from the high temperatures they generate.

The ATS-01F-04-C2-R0 is designed to be a cost-effective heat sink solution. It can be fitted onto devices with minimal effort, and its all-aluminum construction ensures that it can maintain the ideal temperatures in most applications. Its thermal pads can be replaced if necessary, and its fins are designed to be robust and capable of providing reliable cooling for extended periods of time. Its design also ensures that it is easy to install and maintain, making it a great choice for commercial and industrial environments.

The ATS-01F-04-C2-R0 is a revolutionary product that has made thermal management and heat sinks a priority for businesses and consumers alike. Its efficient design and reliable construction make it an ideal choice for any application that needs reliable cooling. It provides a cost-effective solution that is easy to install and maintain, making it one of the most popular heat sink solutions available today. By using the ATS-01F-04-C2-R0, businesses and consumers can be assured that their devices will remain cool and running at their optimal performance levels.

The specific data is subject to PDF, and the above content is for reference

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