| Allicdata Part #: | ATS-01F-07-C1-R0-ND |
| Manufacturer Part#: |
ATS-01F-07-C1-R0 |
| Price: | $ 3.31 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X12.7MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-01F-07-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.00762 |
| 30 +: | $ 2.92635 |
| 50 +: | $ 2.76381 |
| 100 +: | $ 2.60127 |
| 250 +: | $ 2.43868 |
| 500 +: | $ 2.35738 |
| 1000 +: | $ 2.11351 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.500" (12.70mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 16.97°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management solutions are important in the operation of any electronic system, as they ensure that components perform reliably and remain within their operational temperature range. Heat sinks are a vital part of these solutions, as they provide an effective means of dissipating heat away from critical components. The ATS-01F-07-C1-R0 is a specialized heat sink developed for energy-efficient, low-power applications and is most commonly used in fanless computer systems. This article will discuss the application field and working principle of the ATS-01F-07-C1-R0 heat sink.
The ATS-01F-07-C1-R0 heat sink is most commonly used in fanless computer systems, such as thin clients and embedded systems. These systems are typically used in applications that require low power consumption, quiet operation, and efficient heat dissipation. The ATS-01F-07-C1-R0 heat sink features a low profile design, allowing it to fit within the tight confines of a thin client or other compact electronic system. It features a contoured fin shape and a unique slant design, allowing it to easily fit into cramped spaces such as small PC enclosures.
The ATS-01F-07-C1-R0 heat sink is made of aluminum alloy, which provides durability and low cost. It features an integrated fanless design that can effectively dissipate heat with minimal noise. The copper base plate has excellent thermal conductivity, allowing it to transfer heat generated by the system’s components to the aluminum fins. The shape of the fins also helps to increase the surface area and speed up the cooling process.
The working principle of the ATS-01F-07-C1-R0 heat sink is simple: The metal fins act as a large heat sink, absorbing and dissipating the heat generated by the components in the computer system. The copper base plate transfers heat from the components to the fins, where it is then released into the surrounding air. As the air passes over the fins, the heat is dissipated away from the computer system. This keeps the system’s components within their optimal temperature range and ensures that the system runs reliably and efficiently.
In conclusion, the ATS-01F-07-C1-R0 is a specialized heat sink developed for fanless computer systems. It has a slim profile and excellent heat dissipation capabilities, making it perfect for energy-efficient and low-power applications. Furthermore, its integrated fanless design ensures that the system stays quiet, and its aluminum alloy construction ensures durability. The ATS-01F-07-C1-R0 is an ideal heat sink solution for applications that require low power consumption, efficient heat dissipation, and quiet operation.
The specific data is subject to PDF, and the above content is for reference