| Allicdata Part #: | ATS-01F-10-C1-R0-ND |
| Manufacturer Part#: |
ATS-01F-10-C1-R0 |
| Price: | $ 3.61 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X25MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-01F-10-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.28104 |
| 30 +: | $ 3.19242 |
| 50 +: | $ 3.01505 |
| 100 +: | $ 2.83771 |
| 250 +: | $ 2.66036 |
| 500 +: | $ 2.57169 |
| 1000 +: | $ 2.30565 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.87°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is a process of controlling the temperature of a device, product or process. It is important to ensure that your products, components, and processes meet or exceed their performance specifications. The way to do this is to use a thermal management device or component known as a heat sink. Heat sinks are used to dissipate unwanted heat from electronic devices. ATS-01F-10-C1-R0 is one such heat sink that is designed to provide high performance thermal control. This article will discuss its application field and working principle.
Application Field
The ATS-01F-10-C1-R0 is a heat sink designed for use in various fields including industrial, medical, military and consumer electronics. It is suitable for use in a wide range of applications such as motor control, power supply and battery applications. It is also suitable for use in LED lighting and automotive applications. The ATS-01F-10-C1-R0 is a highly efficient heat sink that is capable of providing extremely high thermal performance in extreme conditions.
Working Principle
The ATS-01F-10-C1-R0 is a heat sink that uses a combination of heat dissipation and convection to dissipate heat from the device or component it is attached to. Heat sinks work by conducting the heat away from the heat source and transferring it to the surrounding environment. The heat is then dissipated through a process known as convection. Convection is the mechanism by which air and liquid particles flow around and through a device or component, transferring the heat energy from the component to the environment. In the case of the ATS-01F-10-C1-R0, the heat is dissipated by the fins of the heat sink. The fins act as a medium for the air and liquid particles to move through and the surface of the fin to transfer the heat energy away from the component. This ultimately reduces the temperature of the device or component.
The ATS-01F-10-C1-R0 is a highly efficient heat sink that is capable of providing extremely high thermal performance in extreme conditions. It is designed to dissipate heat from the device or component it is attached to without creating any noise or vibration. It is also designed to be able to withstand high temperatures and is corrosion resistant. For these reasons, the ATS-01F-10-C1-R0 is an ideal solution for thermal management in any application.
The specific data is subject to PDF, and the above content is for reference