ATS-01F-10-C3-R0

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Thermal management is an important factor in the operation of any device. A well-designed thermal system can prevent component overheating, promote efficient system operation, and improve system reliability. In the world of thermal management, an important component is the heat sink. A heat sink is a device that uses a large, thermally-conductive surface area to help dissipate the heat generated by a device or component. One type of heat sink is the ATS-01F-10-C3-R0, a high-performance, cost-effective heat sink designed for a wide range of applications.

The ATS-01F-10-C3-0 is a two-piece aluminum unit featuring two parallel faces connected by a series of ribs. The two faces are connected by pins, and are held together with a series of screws. The surface area on both faces feature embossed fins that help to increase the area of contact between the two surfaces. The fins are spaced in such a way as to promote good cooling and efficient thermal dissipation.

The ATS-01F-10-C3-R0 is designed for use in a variety of applications, including those involving high power components and LED lighting. Specifically, it is well-suited for high-power applications such as LED lighting assemblies, power supplies, and switchmode converters. Additionally, it can be used in applications requiring intensive cooling, such as wearable electronics, heat-protective enclosures, and server rack cooling.

In terms of thermal performance, the ATS-01F-10-C3-R0 is an effective thermal management device. It features a high thermal conductivity of 0.372 W/mK, which allows it to effectively transfer heat away from heated components. Additionally, the ATS-01F-10-C3-R0 has an extremely low thermal resistance of just 0.07°C/W, which further ensures efficient dispersal of heat away from the component. Furthermore, its large surface area of 10 cm2 helps to ensure maximum efficiency when dissipating heat away from a heat source.

In terms of installation, the ATS-01F-10-C3-R0 is quick and easy to install. It comes with a pre-drilled base, making installation a breeze. Additionally, its patented thermal epoxy adhesive offers additional security and improved thermal performance. This ensures that the ATS-01F-10-C3-R0 is firmly secured and helping to dissipate heat from the device while withstanding vibration and extreme temperatures.

The ATS-01F-10-C3-R0 is an ideal choice for a wide range of applications requiring efficient thermal management. Its two-piece construction and high thermal conductivity make it well-suited for applications involving high-power components, LED lighting assemblies, power supplies, switchmode converters, and more. Additionally, its easy installation and low thermal resistance help to ensure that it provides efficient and reliable thermal management performance. For these reasons, the ATS-01F-10-C3-R0 is an ideal choice for anyone looking for an effective heat sink for their thermal management needs.

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