ATS-01F-100-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-01F-100-C3-R0-ND

Manufacturer Part#:

ATS-01F-100-C3-R0

Price: $ 4.69
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 45X45X25MM R-TAB T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-01F-100-C3-R0 datasheetATS-01F-100-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 4.22163
30 +: $ 3.98727
50 +: $ 3.75278
100 +: $ 3.51823
250 +: $ 3.28369
500 +: $ 3.04914
1000 +: $ 2.99050
Stock 1000Can Ship Immediately
$ 4.69
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.772" (45.00mm)
Width: 1.772" (45.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.984" (25.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 8.79°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal-Heat Sinks are essential in maintaining efficient working systems, especially in applications which require heat removal or the transport of heat from one location to another. The ATS-01F-100-C3-R0 is a thermal-heat sink with high efficiency and thermal conductivity.This thermal-heat sink is designed for use in Peltier cooling systems, as it can transfer heat generated in these systems from one location to another. It is constructed with an aluminum fin array and base plate with copper electrodes. These components work together to ensure that the temperature in the system is effectively managed and the generated heat is transferred efficiently.The base plate consists of a copper base made from an alloy of aluminum and copper. The electrodes transfer the heat generated from the Peltier cooling system to the fins, where it is dissipated into the surrounding environment. The fin array consists of multiple aluminum fins, making it highly efficient at dissipating the heat generated. The fins allow for a high surface area to volume ratio, which increases the efficiency of the thermal-heat sink.The ATS-01F-100-C3-R0 also features an innovative design and construction that allows for improved thermal performance. Its construction provides a low thermal resistance, which allows the heat to transfer away from the system with greater ease. Additionally, its construction makes it capable of handling temperatures up to 300°C.In addition to its high efficiency and thermal performance, the ATS-01F-100-C3-R0 also offers durability and reliability. Its construction enables it to withstand continuous operation in demanding environments with minimal degradation of its performance. The total thickness of just 2.8mm makes the heat sink ideal for use in space or weight-constrained designs.Overall, ATS-01F-100-C3-R0 thermal-heat sink is a highly efficient and reliable heat removal and transfer device. Its construction and design enables it to be used in a variety of applications with reliable performance and long-term durability. With its high heat transfer capability and excellent surface area to volume ratio, this thermal-heat sink is an excellent choice for any design requiring efficient heat removal or transfer from one location to another.

The specific data is subject to PDF, and the above content is for reference

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