| Allicdata Part #: | ATS3659-ND |
| Manufacturer Part#: |
ATS-01F-117-C2-R0 |
| Price: | $ 3.75 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X10MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-01F-117-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.40830 |
| 10 +: | $ 3.31695 |
| 25 +: | $ 3.22711 |
| 50 +: | $ 3.04781 |
| 100 +: | $ 2.86858 |
| 250 +: | $ 2.68930 |
| 500 +: | $ 2.59965 |
| 1000 +: | $ 2.33071 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.48°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal management is essential in many areas where electronic components need to operate at high temperatures and electrical losses due to waste heat need to be minimized. The ATS-01F-117-C2-R0 is a component designed to transfer heat away from sensitive components and keep them operating at safe temperatures. It has a variety of applications in industries such as automotive, electronics, defense and aerospace.
The ATS-01F-117-C2-R0 is a heatsink used to dissipate heat from power components, such as semiconductors, in the most efficient manner. This component is made of a high thermal conductivity material, usually aluminum, and has a fin geometry designed for maximum heat transfer. These fins are precision machined for optimal thermal performance and feature multiple slots for attaching heatsink clips for easy installation.
The ATS-01F-117-C2-R0 uses concept of ‘forced convection cooling’. Forced convection is the process by which heat is transferred from a surface in contact with a fluid such as air. Heat energy is absorbed by a liquid or solid and then transferred from the surface of the material and into the air, resulting in cooling of the solid. The heatsink has a large area of fins allowing for an increased rate of heat transfer. It has a single-phase Peltier device, or thermoelectric cooler, which works by transferring heat from one side of the device to another, creating the cooling effect required.
This heatsink is designed for applications such as power supplies, processors, desktop, notebook, and server systems. It is capable of dissipating large amounts of heat generated by high power components, allowing them to operate at safe temperatures. Its use of convection cooling translates into low acoustic noise and increased efficiency as compared to traditional cooling solutions. This makes the ATS-01F-117-C2-R0 the ideal choice for many applications where silent cooling is required.
The installation of the ATS-01F-117-C2-R0 is simple with a broad range of mounting accessories. It allows the installation of different fan sizes for easier configuration. Additionally, the heatsink is designed for maximum reliability and is equipped with a thermal control module with temperature sensors to monitor and control heat generation. It is also designed with a built-in fan for forced air cooling to further improve its efficiency.
The ATS-01F-117-C2-R0 is an effective way to dissipate heat from powerful components. Its use of forced convection cooling results in optimal performance and silent operation. With its broad range of mounting accessories and built-in fan, this heatsink can be easily configured and installed in any application where heat dissipation is of the utmost importance.
The specific data is subject to PDF, and the above content is for reference