ATS-01F-122-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-01F-122-C3-R0-ND

Manufacturer Part#:

ATS-01F-122-C3-R0

Price: $ 3.85
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 50X50X15MM XCUT T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-01F-122-C3-R0 datasheetATS-01F-122-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.49524
30 +: $ 3.40074
50 +: $ 3.21174
100 +: $ 3.02280
250 +: $ 2.83387
500 +: $ 2.73940
1000 +: $ 2.45602
Stock 1000Can Ship Immediately
$ 3.85
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.969" (50.00mm)
Width: 1.969" (50.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.590" (15.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 5.95°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal - Heat Sinks are often used to regulate the temperature of an electrical system, from computers to mobile phone processors. It is an essential piece of equipment in order to keep delicate machinery functioning. The ATS-01F-122-C3-R0 thermal heat sink is a unique, patented product which offers improved heat management and higher efficiency.

The ATS-01F-122-C3-R0 is a passive two-stage heat sink designed for fanless applications. It works by dissipating heat generated by electronic components into an inert medium, usually air or liquid. The two-stage nature of this heat sink provides superior thermal management compared to single-stage designs, as it allows heat to be drawn away from the components more efficiently.

The first stage of the ATS-01F-122-C3-R0 consists of a column of fins which are designed to draw heat away from the components. These fins effectively increase the area over which heat can be dissipated, allowing a greater amount of heat to be removed from the components. The fins are also coated with a special thermal material which aids in the heat transfer process.

The second stage of the heat sink is composed of a dissipation plate attached to the fins. This plate is made from highly conductive material and serves to spread the heat evenly across the surface, allowing the fins to draw away more heat from the components. This helps to keep the components cooler, thus allowing them to operate at a higher efficiency.

The ATS-01F-122-C3-R0 is suitable for use in a wide range of applications, from networking to audio systems, as well as many other electrical and electronic equipment. It is particularly useful in applications where fan noise can be an issue, such as with audio devices. In addition, the two-stage design ensures that the heat is efficiently drawn away from the components, allowing them to perform at their best.

The ATS-01F-122-C3-R0 is an ideal solution for controlling the temperature of sensitive electrical and electronic components. Its two-stage design ensures improved heat management, while remaining fanless and noise-free. With its range of applications, it is a versatile and highly effective thermal heat sink.

The specific data is subject to PDF, and the above content is for reference

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