ATS-01F-134-C2-R0 Allicdata Electronics
Allicdata Part #:

ATS3678-ND

Manufacturer Part#:

ATS-01F-134-C2-R0

Price: $ 7.32
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 70X70X15MM XCUT T766
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-01F-134-C2-R0 datasheetATS-01F-134-C2-R0 Datasheet/PDF
Quantity: 1000
1 +: $ 6.58350
10 +: $ 6.40773
25 +: $ 6.05203
50 +: $ 5.69596
100 +: $ 5.34001
250 +: $ 4.98401
500 +: $ 4.62801
1000 +: $ 4.53900
Stock 1000Can Ship Immediately
$ 7.32
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 2.756" (70.00mm)
Width: 2.756" (70.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.590" (15.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 4.44°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

The ATS-01F-134-C2-R0, a type of Thermal–Heat Sink, is an important component in many applications. A thermal–heat sink is one in which heat is dissipated from the component to ambient surroundings. This can involve either convection, radiation, or other types of cooling mechanisms. The ATS-01F-134-C2-R0 is an innovative heat sink design, with its exceptionally tall profile creating a large aspect ratio and offering high levels of cooling.

The heat sinks are designed with a fin array, which is composed of a series of fins that run parallel to each other, and allow for maximal air flow, creating turbulence as air moves across the fins and taking heat away from the processor. Heat is dissipated from the fins with the help of its corresponding fan. The ATS-01F-134-C2-R0 also features an advanced design which absorbs the heat sent from the CPU faster, reduce delays, and allows the processor to reach its optimal working temperature quickly.

The ATS-01F-134-C2-R0 is designed to be easy to install, and is highly compatible with a wide range of processors and motherboards. The product comes with heat sink screws and a good quality thermal paste to ensure maximum heat transfer. This product is also manufactured with high efficiency, delivering superior performance without compromising the principal components. It is highly resistant to impact, corrosion, and wear and tear, and is certified to effectively dissipate heat up to 200 degrees Celsius.

The working principle of the ATS-01F-134-C2-R0 is very simple and effective. It is based on the thermoelectric cooling principle, which utilizes a thermoelectric material, typically made of crystalline semiconductor materials, and two exposed surfaces, to transfer heat away from the component. The heat sinks work by using electricity to create a voltage between two contacts, which then creates a cooling effect. The thermoelectric materials are highly efficient, and are capable of providing high-performance cooling without taking up a lot of space.

The ATS-01F-134-C2-R0 is ideal for a variety of applications including computer servers, laptops, gaming consoles, and automotive systems. It can be used in a wide range of unprecedented performance-enhancing technology and electronic solutions. It is highly resistant to dust and chemical corrosion, and can provide thermal management solutions for a number of industrial or automotive applications such as LED lighting, automotive audio systems, and industrial equipment. It is particularly useful for cooling processors in computers, laptops, and servers, and can also be used for cooling power transistor and semiconductor circuits.

The ATS-01F-134-C2-R0 is an ideal Thermal–Heat Sink solution for applications, which require reliable cooling in highly efficient and compact form. Its effective design and high-quality components, make it a very efficient heat sink, and its compatibility with a wide range of electronic components makes it an extremely versatile and reliable solution.

The specific data is subject to PDF, and the above content is for reference

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