ATS-01F-134-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	2.756" (70.00mm)
Width:	2.756" (70.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.590" (15.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	4.48°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction

ATS-01F-134-C3-R0 is a thermal-heat sink designed to quickly and efficiently disperse heat generated by electronic components. By improving the overall efficiency of the application, it can help reduce operational costs and significantly reduce risk of potential system failure due to component overheating.

Design & Features

The ATS-01F-134-C3-R0 thermal-heat sink features a heat dissipation area of 134mm square. Its body is formed from high-density aluminum and features pin-fin design to maximize heat transfer. The unit includes integrated mounting brackets for sturdy and secure mounting to any flat surface.In addition, the ATS-01F-134-C3-R0 also has a built-in thermal overload protection. This ensures that the inrush current of the component is not exceeded and prevents the components from experiencing any temperature-related damage. The unit also includes a built-in thermal compensation circuit and temperature sensing probe. This ensures the optimal temperature setting for the environment and ensures the best possible cooling performance.

Application Fields and Working Principle

A primary application of the ATS-01F-134-C3-R0 thermal-heat sink is the cooling of electronic components, including processors, GPUs, ASICs, FPGAs, and other high-power components. The unit can be used in a variety of applications, including communications, media and broadcast, medical systems, automotive electronics, and more.The working principle of this thermal-heat sink is based on the thermal radiation theory. The principle states that heat is transferred from a warm object to a cooler object through thermal radiation. In this case, the thermal-heat sink absorbs the heat generated by the electronic component and transfers it to the ambient air. This allows the component to operate within its maximum temperature threshold, ensuring a stable and reliable operation.

Installation and Maintenance

The ATS-01F-134-C3-R0 thermal-heat sink is designed to be installed quickly and easily, with minimal effort. The included mounting brackets feature self-guiding slots and pre-drilled holes for quick and secure mounting. For regular maintenance, it’s important to keep the unit’s thermal interface material clean and free from debris. This ensures maximum heat transfer efficiency and performance.

Conclusion

The ATS-01F-134-C3-R0 thermal-heat sink is an efficient and reliable solution for cooling high-power electronic components. Its pin-fin design and built-in thermal overload protection ensures optimal heat transfer performance and temperature control. With its simple installation and maintenance requirements, it’s a great choice for a wide range of applications.

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