| Allicdata Part #: | ATS3696-ND |
| Manufacturer Part#: |
ATS-01F-150-C2-R0 |
| Price: | $ 4.21 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X25MM L-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-01F-150-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.83040 |
| 10 +: | $ 3.72456 |
| 25 +: | $ 3.51767 |
| 50 +: | $ 3.31065 |
| 100 +: | $ 3.10376 |
| 250 +: | $ 2.89684 |
| 500 +: | $ 2.68992 |
| 1000 +: | $ 2.63820 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 4.82°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management solutions are essential components of many electronics and electrical systems. In order to ensure that the electronic and electrical systems operate efficiently and effectively, it is necessary to keep their internal temperature at optimal levels. The ATS-01F 150-C2-R0 is one such solution that has been engineered to provide efficient thermal management. This article will discuss the application field and working principle of the ATS-01F 150-C2-R0.
The ATS-01F 150-C2-R0 is a thermal-heat sink designed for use in a variety of applications. This heat sink can be used to dissipate heat from CPUs, GPUs, and other similar types of semiconductor components. It is also designed to efficiently manage the thermal environment of high-power electronics and electrical systems. This is accomplished through its unique combination of materials. The heat sink is made of a combination of aluminum, copper, and metalized plastic. This allows it to effectively conduct and dissipate heat away from the heat sources.
The ATS-01F 150-C2-R0 is designed to provide a highly efficient heat sink solution for a variety of electronic and electrical applications. It is constructed from top-of-the-line materials and designed with specialized features to ensure that it provides the highest levels of thermal performance. Its construction consists of a heavy-duty aluminum base that is lined with a thin layer of copper. This provides a high thermal conductivity that helps dissipate heat away from the heat sources.
The ATS-01F 150-C2-R0 also features a distinctive airflow pattern that ensures effective thermal management. This airflow pattern utilizes a unique fin design that helps dissipate heat away from the heat sources. The fins are also designed to provide an increase in the surface area that is exposed to the airflow. This increased surface area further enhances its efficiency by allowing more air to flow through the heat sink.
The ATS-01F 150-C2-R0 also features a number of features that help improve its ability to provide effective thermal management. It has an integrated cooling fan that provides additional airflow that helps keep temperatures down. In addition, the heat sink also features a captive-mount design that helps reduce the weight of the system. This helps improve the cooling performance of the electronic and electrical systems.
The ATS-01F 150-C2-R0 is a reliable and efficient thermal solution that is suitable for a variety of different applications. This heat sink is designed to provide maximum performance and efficiency in a wide variety of different applications. Its combination of materials and airflow pattern makes it an ideal solution for both industrial and consumer applications. This thermal-heat sink is also compatible with a number of different types of fans, making it even more versatile.
In conclusion, the ATS-01F 150-C2-R0 is a reliable and efficient thermal-heat sink that is designed to provide a highly efficient thermal management solution for a wide variety of different applications. Its combination of materials, airflow pattern, and other features make it an ideal solution for both industrial and consumer applications. This heat sink is highly compatible with a variety of fans and is designed to provide maximum performance and efficiency while also reducing the weight of the system.
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