| Allicdata Part #: | ATS3706-ND |
| Manufacturer Part#: |
ATS-01F-16-C2-R0 |
| Price: | $ 4.45 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X10MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-01F-16-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 4.05090 |
| 10 +: | $ 3.94443 |
| 25 +: | $ 3.72506 |
| 50 +: | $ 3.50608 |
| 100 +: | $ 3.28690 |
| 250 +: | $ 3.06777 |
| 500 +: | $ 2.84864 |
| 1000 +: | $ 2.79387 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 18.08°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal energy is generated as a result of mechanical processes such as friction and combustion. Heat generated by these processes is dissipated and dissipated through either direct contact with a colder environment or through the use of heat dissipation devices such as heat sinks and fans. The primary purpose of a heat sink is to dissipate heat from an electronic component.
The ATS-01F-16-C2-R0 is a heat dissipation device commonly used to protect electronic components from thermal damage. It is a two-stage device, constructed from an aluminum heat sink and a thermal pad. The aluminum heat sink is designed to absorb heat from a component, such as a microprocessor, and transfer it away from the component to the atmosphere. The thermal pad, on the other hand, absorbs heat from the component and transfers it to the heat sink.
The ATS-01F-16-C2-R0 is used in a wide range of applications, ranging from automotive to computer systems. In automotive applications, ATS-01F-16-C2-R0 is used to dissipate heat from microprocessor and electronic engine control units. This reduces the chances of an engine overheating due to excessive heat. In computer systems, ATS-01F-16-C2-R0 is typically used to cool the onboard CPU, RAM, and other components.
The working principle of the ATS-01F-16-C2-R0 is relatively simple. Heat generated by the component is first transferred through the thermal pad to the aluminum heat sink. The aluminum heat sink then acts as a heatsink, dissipating the heat away from the component to the atmosphere. The aluminum heat sink is designed with fins, which help to increase the surface area exposed to the atmosphere, allowing for more efficient heat exchange.
In addition to the aluminum heat sink, the ATS-01F-16-C2-R0 also comes with a fan to further assist with dissipating the heat away from the component. The fan draws in air from the surroundings, passes it through the aluminum heat sink, and then releases the air, taking away any excess heat with it.
The ATS-01F-16-C2-R0 is an effective and efficient heat dissipation device, capable of protecting electronic components from thermal damage caused by excessive heat. It is a reliable and durable device, and can be used in a variety of applications and environments.
The specific data is subject to PDF, and the above content is for reference