| Allicdata Part #: | ATS-01F-19-C3-R0-ND |
| Manufacturer Part#: |
ATS-01F-19-C3-R0 |
| Price: | $ 4.49 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X20MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-01F-19-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.03704 |
| 30 +: | $ 3.81255 |
| 50 +: | $ 3.58823 |
| 100 +: | $ 3.36401 |
| 250 +: | $ 3.13974 |
| 500 +: | $ 2.91548 |
| 1000 +: | $ 2.85942 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 9.84°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is critical for many applications and the use of thermal - heat sinks is an effective way to dissipate heat. The ATS-01F-19-C3-R0 is an industry leading thermal - heat sink, and it is frequently used in a range of different applications. This article will explain the application field and working principle of the ATS-01F-19-C3-R0.
The ATS-01F-19-C3-R0 is a highly efficient and reliable thermal - heat sink specifically designed for use in applications that require superior cooling, such as in telecommunications and network equipment. The product is constructed from a durable aluminum alloy which has been thermally treated to provide maximum heat dissipation. Its unique air inlet and outlet design allows it to be used in any orientation without any loss of efficiency. The product also offers a low profile design that is ideal for tight installation spaces.
The ATS-01F-19-C3-R0 is designed to provide efficient and reliable cooling for a variety of different applications. It is particularly well suited for applications where there is a combination of high ambient temperature and high power consumption. This includes equipment such as servers, storage systems, and even industrial machinery. The product is capable of dissipating up to 16,000 watts of thermal energy and is designed to operate in a temperature range of -40°C to 100°C.
The ATS-01F-19-C3-R0 is an effective and reliable thermal - heat sink that works on the principle of transferring heat from the heat source to the surroundings. This is achieved through the use of a Peltier element, a type of thermoelectric cooling device that utilizes the Peltier effect. When the Peltier element is supplied with power, electrical current builds up on one face of the element, creating a temperature difference between each side of the device. This results in the transfer of thermal energy from one side of the element to the other, cooling the heat source while releasing the heat to the environment.
The ATS-01F-19-C3-R0 is a highly efficient thermal - heat sink and offers superior performance for applications requiring efficient and reliable thermal management. Its low profile design and efficient cooling characteristics make it perfect for space-intensive and power-intensive applications. It is also designed to operate in a broad temperature range and is capable of dissipating up to 16,000 watts of thermal energy. Overall, the ATS-01F-19-C3-R0 offers an efficient and reliable thermal - heat sink solution for a variety of applications.
The specific data is subject to PDF, and the above content is for reference