| Allicdata Part #: | ATS-01F-192-C1-R0-ND |
| Manufacturer Part#: |
ATS-01F-192-C1-R0 |
| Price: | $ 3.99 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X35MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-01F-192-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.62061 |
| 30 +: | $ 3.41922 |
| 50 +: | $ 3.21817 |
| 100 +: | $ 3.01701 |
| 250 +: | $ 2.81588 |
| 500 +: | $ 2.61474 |
| 1000 +: | $ 2.56446 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.378" (35.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 2.33°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is an important factor in ensuring reliable and consistent performance in many electronic devices. Heat sinks are the most commonly used type of thermal management products, and the ATS-01F-192-C1-R0 is a popular product in this category. This article will provide an overview of the application field and working principle of the ATS-01F-192-C1-R0.
What Is a Heat Sink?
A heat sink is a device used to dissipate heat from an electronic device or system. It is usually composed of numerous metal fins and a base plate that absorbs heat from a processor, transistor, or other component. Heat sinks are designed to transfer heat away from the source and into the environment. In addition, they are often equipped with an individual fan to further increase airflow over the device.
The ATS-01F-192-C1-R0
The ATS-01F-192-C1-R0 is a heat sink designed for use in electronics such as computers, servers, and data centers. It is composed of a series of rectangular-shaped metal fins and a base that are connected to a plastic frame. The fins are designed to help dissipate heat quickly and efficiently, while the plastic frame provides stability and protection for the device.
The ATS-01F-192-C1-R0 has a thermal resistance of 0.16 °C/W, which means it is capable of efficiently dissipating heat without exceeding the maximum temperature of the components to which it is connected. The design of the ATS-01F-192-C1-R0 ensures maximum performance in a variety of conditions, including higher temperatures and decreased airflow conditions.
Application Field
The ATS-01F-192-C1-R0 is designed for use in electronic components that require cooling solutions. It is ideal for use in a wide range of applications, including: computers, servers, digital signage, network equipment, medical equipment, industrial controls, automotive systems, and other industrial applications.
Working Principle
The heat sink works by transferring the heat generated by the components to which it is connected to its metal fins. These fins have a large surface area which allows for increased heat dissipation. As the heat is transferred to the fins, it is dissipated into the environment, allowing the components to cool. The fins are made of a combination of different materials such as aluminum, copper, and steel, to ensure they can effectively dissipate the heat.
The ATS-01F-192-C1-R0 also has a plastic frame which helps to stabilize the device during operation. The plastic also helps to protect the device from damage as it ensures that the metal fins are securely attached to the frame. Additionally, the plastic helps to reduce vibrations which could potentially damage the device.
The ATS-01F-192-C1-R0 is equipped with an individual fan which is used to increase the efficiency of heat transfer from the device to the fins. The fan is attached to one side of the device and is designed to draw air from the environment and blow it over the fins. This helps to ensure that the dissipated heat is quickly removed from the device.
Conclusion
The ATS-01F-192-C1-R0 is a thermal management product designed for use in a variety of electronic components. It has a thermal resistance of 0.16 °C/W and is capable of dissipating heat quickly and efficiently. It is also equipped with a fan to increase the efficiency of heat transfer. The ATS-01F-192-C1-R0 is ideal for use in computers, servers, digital signage, network equipment, industrial controls, and automotive systems.
The specific data is subject to PDF, and the above content is for reference