| Allicdata Part #: | ATS-01F-195-C1-R0-ND |
| Manufacturer Part#: |
ATS-01F-195-C1-R0 |
| Price: | $ 3.13 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X12MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-01F-195-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.81736 |
| 30 +: | $ 2.74134 |
| 50 +: | $ 2.58905 |
| 100 +: | $ 2.43671 |
| 250 +: | $ 2.28446 |
| 500 +: | $ 2.20830 |
| 1000 +: | $ 1.97985 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.472" (12.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.88°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are important components that thermal engineers use to help prevent overheating. They disperse, redirect, and dissipate the heat generated by an electronic component or system in order to protect the device or system from permanent damage or shutdown. The choice of an appropriate heat sink is critical for achieving maximum performance in any application. The ATS-01F-195-C1-R0 heat sink from AAC is an advanced thermal product that offers excellent performance for a wide range of applications.
The ATS-01F-195-C1-R0 is a state-of-the-art heat sink that provides superior cooling for electronic devices and components. It takes advantage of the latest in heat-transfer technology and features a 1.5 mm thick extrusions made of aluminum alloy. This heat sink has a high thermal conductivity of 195 W/m_K and is designed for maximum compatibility with various platforms and components. It has an effective area of 18.6 square centimeters, allowing it to dissipate up to 350 Watts of heat with just a tiny footprint.
The ATS-01F-195-C1-R0 heat sink is designed to offer superior performance in various applications, such as cooling microprocessors, graphic processors, power supplies, and other high-power devices. Its modular design and variety of sizes make it ideal for multiple applications. The heat sink has a natural convection coefficient of 45 W/m2_K. This allows it to dissipate even greater levels of heat in applications that require increased thermal efficiency.
The ATS-01F-195-C1-R0 heat sink is designed for easy installation and compatibility with all types of electronic components. Its open-air design makes it simple to mount on any flat surface without the need for extra hardware or complex wiring. The heat sink can also be mounted on top of existing components without blocking airflow or causing interference. It\'s ideal for mounting on the top side of components, as it allows for easy access to the device\'s pins and connectors.
The ATS-01F-195-C1-R0 heat sink is designed to work in harsh environments, such as those with high temperatures and harsh elements. It is resistant to corrosion and vibration, making it suitable for use in many types of industrial applications. This heat sink also features an innovative thermal buffer design that helps it to better dissipate heat and provide superior cooling performance.
The ATS-01F-195-C1-R0 is an innovative thermal solution with a wide range of applications. It offers superior cooling performance for all types of electronic components and devices, eliminating the need for expensive air conditioning systems or complex cooling systems. Its open design makes it easy to mount on any flat surface without interfering with existing components, while its resistance to corrosion and vibration make it suitable for use in harsh environments. If you\'re looking for a reliable and efficient thermal solution, the ATS-01F-195-C1-R0 heat sink is the perfect choice.
The specific data is subject to PDF, and the above content is for reference