| Allicdata Part #: | ATS-01F-20-C3-R0-ND |
| Manufacturer Part#: |
ATS-01F-20-C3-R0 |
| Price: | $ 4.67 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X25MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-01F-20-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.19895 |
| 30 +: | $ 3.96543 |
| 50 +: | $ 3.73225 |
| 100 +: | $ 3.49896 |
| 250 +: | $ 3.26570 |
| 500 +: | $ 3.03243 |
| 1000 +: | $ 2.97412 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.21°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are essential components of any electronic device, helping to reduce power consumption and increase the efficiency of electronic components. The ATS-01F-20-C3-R0 heat sink is an excellent option for temperature control at a variety of applications. This article will cover the ATS-01F-20-C3-R0 heat sink’s application field and working principle.
Application Field of ATS-01F-20-C3-R0 Heat Sink
The ATS-01F-20-C3-R0 heat sink is designed to be used in a wide range of applications, including computer, communication, military, medical, consumer electronics, and other thermal management related products. The ATS-01F-20-C3-R0 is suitable for cooling high power density components or helping to maintain a desired temperature. It features a thermal conductance of more than 4.5 W/m•K, a fast-on push spring connection terminal, a thin profile, and low thermal resistance.
The ATS-01F-20-C3-R0 can be employed in CPU coolers, graphic cards and motherboards, power supplies, and other high power electronic components. In addition, it can be used in a wide variety of other industrial fields, from medical imaging systems to automotive electronics.
Working Principle and Characteristics
The ATS-01F-20-C3-R0 heat sink uses a thermal conduction mechanism which transfers heat energy from the device’s components to its structure, dissipating the heat away from the area. The heat sink features a cage thermal structure, which is made of high-heat resistant material such as copper, aluminum, or iron. The material of the heat sink also contributes to its excellent thermal performance.
The ATS-01F-20-C3-R0 heat sink has a thin profile, enabling it to be employed with components which have limited mounting space. Moreover, the innovative push spring connection terminal of the ATS-01F-20-C3-R0 ensures a reliable contact with the component. This terminal can be disconnected with a simple push-in or pull-out action, allowing for easy installation or removal of the heat sink. In addition, the ATS-01F-20-C3-R0 offers advantages such as excellent mechanical protection and vibration resistance.
To summarize, the ATS-01F-20-C3-R0 heat sink is a robust and reliable thermal solution for a variety of thermal management applications. With its cage thermal structure, low thermal resistance, fast-on push spring connection terminal, and thin profile, it is suitable for a wide range of products, including CPUs, graphics cards, power supplies, industrial equipment and more.
The specific data is subject to PDF, and the above content is for reference