ATS-01F-200-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.969" (50.00mm)
Width:	1.969" (50.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.394" (10.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	9.76°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction

Heat Sinks are used to dissipate thermal energy produced by electric and/or electronic components, and come in many shapes and sizes. The ATS-01F-200-C1-R0 heat sink is a form of aluminum heat sink that is used to provide cooling for a wide variety of applications. In this article, we will discuss the application field and working principle of the ATS-01F-200-C1-R0 heat sink.

Application Field

The ATS-01F-200-C1-R0 heat sink is specifically designed for power supplies and arrays. It consists of a conductive base attached to a finned aluminum heat sink, with a Thermal Resistance of 0.31°C/W. This makes it an ideal heat sink for applications which require long-term operation at high temperatures, such as plasma TVs, power supplies, electric motors, automotive electronics, communication devices, consumer electronics, and other high-powered applications.The ATS-01F-200-C1-R0 heat sink is also suitable for use in packages that are placed either inside or outside of an enclosure. It can easily be attached to a variety of materials, such as steel, aluminum, and polyurethane foam. It can also be used in an enclosed environment, such as when it is placed between two separate objects to allow air to circulate between them.

Working Principle

The ATS-01F-200-C1-R0 heat sink works by transferring heat away from the surface of the part it is attached to and dissipating it into surrounding air. When two objects come into contact with each other, heat will flow from the warmer object to the cooler one. The ATS-01F-200-C1-R0 heat sink is designed to maximize this heat transfer by conducting the heat away from the part and dissipating it into the surrounding air.The ATS-01F-200-C1-R0 heat sink is designed to have maximum surface area, so more air is exposed to the surface of the heat sink, allowing it to dissipate more heat. This is accomplished by providing a finned aluminum heat sink, which increases the surface area while remaining lightweight and portable. The thermal resistance of the ATS-01F-200-C1-R0 heat sink is 0.31°C/W; this provides optimal cooling and eliminates any negative thermal issues.

Conclusion

The ATS-01F-200-C1-R0 heat sink is a reliable and efficient form of aluminum heat sink that is used to provide cooling for a wide variety of applications. It is specifically designed for power supplies and arrays, with a thermal resistance of 0.31°C/W that provides optimal cooling and eliminates any negative thermal issues. This heat sink is also easily attached to a variety of materials, making it a great choice for any application that requires long-term and high-temperature operation.

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