![ATS-01F-200-C3-R0 Allicdata Electronics](https://files.allicdata.com/upload/common/default.jpg)
Allicdata Part #: | ATS-01F-200-C3-R0-ND |
Manufacturer Part#: |
ATS-01F-200-C3-R0 |
Price: | $ 3.81 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Advanced Thermal Solutions Inc. |
Short Description: | HEATSINK 50X50X10MM XCUT T412 |
More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
DataSheet: | ![]() |
Quantity: | 1000 |
10 +: | $ 3.45933 |
30 +: | $ 3.36588 |
50 +: | $ 3.17898 |
100 +: | $ 2.99193 |
250 +: | $ 2.80496 |
500 +: | $ 2.71146 |
1000 +: | $ 2.43095 |
Series: | pushPIN™ |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method: | Push Pin |
Shape: | Square, Fins |
Length: | 1.969" (50.00mm) |
Width: | 1.969" (50.00mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.394" (10.00mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | 9.90°C/W @ 100 LFM |
Thermal Resistance @ Natural: | -- |
Material: | Aluminum |
Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal heat sinks are an integral part of the cooling process in many industries. They are used to help reduce the heat generated within a device by dissipating it into the surrounding environment, thus reducing the chance of the device overheating and damaging components. The ATS-01F-200-C3-R0 is a thermal heat sink designed to provide efficient thermal performance in applications with high-efficiency and low-noise requirements.
The ATS-01F-200-C3-R0 thermal heat sink features a “High Thermal Performance” design, which utilizes a unique, non-conductive piece of aluminum foil to provide optimal thermal transfer. This thermal material is sandwiched between two aluminum sheets to create an effective heat dissipating structure. The aluminum sheets are then clamped together with a set of three silver-plated screws, ensuring optimal heat conduction and maximum thermal performance.
The ATS-01F-200-C3-R0 also employs an innovative “High Noise Reduction” design. This design utilizes two strategically placed dampers, which act as a cushion between the aluminum sheets and the environment. This design significantly reduces operating noise levels by absorbing and dampening any vibration created when the device is operated.
The ATS-01F-200-C3-R0’s high-efficiency design combines with its low-noise construction to create an ideal cooling solution for components that require both adequate cooling and quiet operation. The aluminum foil layer increases the thermal transfer capacity of the heat sink, while the dampeners reduce any generated noise. This combination of features provides an ideal form factor for computer systems, allowing for efficient cooling in a quiet package.
The ATS-01F-200-C3-R0 thermal heat sink is ideal for applications in which high-efficiency cooling and low-noise operation are a must. It is made from durable aluminum material that is able to withstand the heat generated by components, and is small enough to fit into tight spaces, allowing it to fit into smaller devices. Along with its efficient and quiet cooling, the ATS-01F-200-C3-R0 is an ideal thermal solution for many applications.
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