
Allicdata Part #: | ATS-01F-24-C3-R0-ND |
Manufacturer Part#: |
ATS-01F-24-C3-R0 |
Price: | $ 5.40 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Advanced Thermal Solutions Inc. |
Short Description: | HEATSINK 60X60X20MM XCUT T412 |
More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
DataSheet: | ![]() |
Quantity: | 1000 |
10 +: | $ 4.85793 |
30 +: | $ 4.58808 |
50 +: | $ 4.31827 |
100 +: | $ 4.04838 |
250 +: | $ 3.77849 |
500 +: | $ 3.50860 |
1000 +: | $ 3.44112 |
Series: | pushPIN™ |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method: | Push Pin |
Shape: | Square, Fins |
Length: | 2.362" (60.00mm) |
Width: | 2.362" (60.00mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.790" (20.00mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | 8.43°C/W @ 100 LFM |
Thermal Resistance @ Natural: | -- |
Material: | Aluminum |
Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Heatsinks are a vital component of the electronics or computer industry. ATS\'s ATS-01F-24-C3-R0 heatsink is a thermal protection device designed to transfer heat produced by electronic components away from sensitive components. This heatsink helps to reduce the operating temperature of electronic components and ensure reliable operation.
The ATS-01F-24-C3-R0 heatsink is made from aluminum with a minimum thickness of 0.4mm and a maximum height of 24mm. It has two extending fins that provide additional surface area for the heat to be dissipated. The ATS-01F-24-C3-R0 is designed to snugly fit in many different electronic systems.
The ATS-01F-24-C3-R0 heatsink provides excellent performance in terms of heat dissipation and is designed for applications that require high power dissipation in small form factor devices. Common applications of the ATS-01F-24-C3-R0 heatsink include CPUs, microprocessors, FPGAs, GPUs, power amplifiers, and other power-demonstrating electronics.
The working principle of the ATS-01F-24-C3-R0 heatsink is convection. Convection cooling occurs when the heated air from the components is cooled by the extended fins and expelled from the system. This process greatly reduces the operating temperature of the component and prevents it from overheating, thus ensuring reliable operation.
The ATS-01F-24-C3-R0 heatsink is a cost-effective solution for a wide variety of cooling applications. Its superior heat dissipation capabilities and easy installation make it a popular choice for many engineers and businesses. With its low-profile design and superior thermal performance, the ATS-01F-24-C3-R0 heatsink can be used in a variety of electronic devices without compromising performance.
The specific data is subject to PDF, and the above content is for reference