| Allicdata Part #: | ATS3766-ND |
| Manufacturer Part#: |
ATS-01F-25-C2-R0 |
| Price: | $ 6.25 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 60X60X25MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-01F-25-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 5.62590 |
| 10 +: | $ 5.47092 |
| 25 +: | $ 5.16726 |
| 50 +: | $ 4.86322 |
| 100 +: | $ 4.55925 |
| 250 +: | $ 4.25530 |
| 500 +: | $ 3.95135 |
| 1000 +: | $ 3.87536 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.362" (60.00mm) |
| Width: | 2.362" (60.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 6.26°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is an essential part of an electronic device’s design process. Poor thermal management can often lead to problems such as overheating and component failure. Heat sinks are the primary thermal management tool used in electronic products to dissipate heat and reduce temperatures. The ATS-01F-25-C2-R0 is a thermoelectric heat sink designed to improve thermal performance in a variety of applications.
The ATS-01F-25-C2-R0 measures 25mm x 25mm x 24mm and offers minimal assembly, along with a high-performance level. It has a solid copper heat spreader plate with two spaced apart mounting studs for secure installation. This heat sink features an atmosphere pressure air gap between the heat spreader and the module, allowing it to draw heat away from the device or component at a more efficient rate than standard heat sinks. The ATS-01F-25-C2-R0 is suitable for use in a wide range of applications, including optoelectronic devices, automotive electronics, handheld electronics, and home appliances.
The ATS-01F-25-C2-R0 works on the principle of thermoelectrics. Thermoelectrics involve the transfer of heat using a combination of electrical and thermal energy. This heat sink uses electrical power to generate a temperature differential between two sides of the heat sink. Heat is then transferred from the hotter side to the cooler side through Peltier junctions. By doing this, heat can be efficiently dissipated from the device.
The ATS-01F-25-C2-R0 has a wide range of applications. It can be used in computer chip systems, high-speed communications, automotive, and medical devices. It can also be used to cool systems that require a stable temperature and low thermal resistance. These include power supplies, CPUs, GPUs, and LED lighting. This heat sink is also suitable for cooling small components such as memory devices and microprocessors.
The ATS-01F-25-C2-R0 can be used to cool temperature sensitive electronic components such as CPUs, GPUs, ASICs, and other components. By efficiently dissipating heat away from the device, the performance of the device can be significantly improved. This heat sink is also capable of achieving temperatures as low as -10°C, which is ideal for cooling high performance and temperature sensitive components.
The ATS-01F-25-C2-R0 is an efficient thermoelectric heat sink that can be used in a variety of applications to improve thermal performance. This heat sink uses electrical power to generate a temperature differential between two sides of the heat sink. This allows the heat to be efficiently dissipated from the device, resulting in improved performance. The heat sink is small and lightweight, making it suitable for use in a wide range of applications, including optoelectronic devices, automotive electronics, handheld electronics, and home appliances.
The specific data is subject to PDF, and the above content is for reference