ATS-01F-38-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-01F-38-C1-R0-ND

Manufacturer Part#:

ATS-01F-38-C1-R0

Price: $ 5.58
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 36.83X57.6X22.86MM
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-01F-38-C1-R0 datasheetATS-01F-38-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 5.01984
30 +: $ 4.74117
50 +: $ 4.46216
100 +: $ 4.18333
250 +: $ 3.90444
500 +: $ 3.62555
1000 +: $ 3.55582
Stock 1000Can Ship Immediately
$ 5.58
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Rectangular, Fins
Length: 1.450" (36.83mm)
Width: 2.267" (57.60mm)
Diameter: --
Height Off Base (Height of Fin): 0.900" (22.86mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 6.40°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management is essential in many industrial applications because it is essential for the operation and longevity of electronic devices. Heat sinks play an essential role in this process, dissipating excess heat created by the components of a system to maintain optimal temperatures. The ATS-01F-38-C1-R0 is a heat sink used for cooling electronic components. In this article, we will explore the application field and working principles of the ATS-01F-38-C1-R0.

The ATS-01F-38-C1-R0 is typically used for cooling electronic components which dissipate a large amount of heat, such as power supplies, amplifiers, and processors. This model has a variety of features that make it ideal for these applications. It has a large surface area that enables it to dissipate considerable amounts of heat, and it has a robust construction that allows it to survive in harsh conditions. Additionally, it has a slim design that makes it suitable for applications where space is limited. Furthermore, it has a highly efficient design that allows it to dissipate more heat while using less electricity.

The ATS-01F-38-C1-R0 features a unique fin arrangement that enables it to dissipate heat more effectively. It has a fanless design, which makes it ideal for operations requiring low levels of noise. Additionally, the fins are designed to create an airflow that improves the heat dissipation efficiency of the device. This design also reduces the pressure drop caused by the device, which increases the efficiency of the device.

The ATS-01F-38-C1-R0 has been designed to improve the efficiency of cooling applications. By using natural convection and a unique fin arrangement, it is able to dissipate heat more effectively than conventional heat sinks. These features enable it to maintain smaller differences in temperature between components, which reduces the risk of overheating and increases the lifetime of the components. Additionally, the device’s low levels of noise production make it suitable for use in environments where noise levels must be kept to a minimum.

In short, the ATS-01F-38-C1-R0 is a heat sink designed for cooling components which dissipate a large amount of heat. It features a unique fin arrangement and a fanless design that enables it to dissipate heat efficiently and quietly. Additionally, its robust construction and slim design make it suitable for use in a variety of applications where space is limited. Overall, it is an efficient, reliable, and quiet solution for thermal management applications.

The specific data is subject to PDF, and the above content is for reference

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