| Allicdata Part #: | ATS3779-ND |
| Manufacturer Part#: |
ATS-01F-50-C2-R0 |
| Price: | $ 3.72 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X15MM L-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-01F-50-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.38310 |
| 10 +: | $ 3.29301 |
| 25 +: | $ 3.20393 |
| 50 +: | $ 3.02602 |
| 100 +: | $ 2.84798 |
| 250 +: | $ 2.67002 |
| 500 +: | $ 2.58101 |
| 1000 +: | $ 2.31400 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 19.03°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is essential for many electronic components and devices; without it, they would overheat and be prone to catastrophic failure. Heat sinks are one of the most common methods of dissipating heat from electronic components, and ATS-01F-50-C2-R0 is a specialized heat sink designed for the purpose. This article will discuss the application field of this product and the working principle of its components.
ATS-01F-50-C2-R0 is designed for use in medical applications, such as medical imaging equipment. It is a high quality heat sink designed to dissipate heat efficiently and provide thermal stability. It is designed to have a very high surface area, which allows it to dissipate heat quickly. This makes it ideal for applications where the heat generated by the electronic components needs to be dissipated in a safe and efficient manner.
The ATS-01F-50-C2-R0 heat sink consists of a base plate made from an extruded aluminum alloy and two heat dissipating fins made from a copper alloy. The base plate is then attached to a mounting plate using spring pressure screws. This ensures that the base plate remains in contact with the fins, allowing for maximum heat dissipation. The heat generated by the electronic components is first transferred to the base plate and then dissipated through the fins.
The ATS-01F-50-C2-R0 heat sink is also designed to ensure maximum cooling performance, even in environments with high ambient temperatures. This is achieved through the use of a unique "spiral" fin design. This design reduces air resistance and allows air to rapidly move around the fins, allowing for maximum airflow and efficient heat dissipation. As a result, the ATS-01F-50-C2-R0 heat sink can operate safely and efficiently in a range of applications.
The ATS-01F-50-C2-R0 heat sink is also designed to be durable and long-lasting. It is constructed from high-quality materials that are corrosion resistant and designed to withstand a wide range of environmental conditions. The design of the fins also makes them highly resistant to wear and tear, ensuring a long product life.
In conclusion, ATS-01F-50-C2-R0 is a high-performance thermal management product designed to provide efficient heat dissipation in medical applications. It is designed to provide long-term reliability and durability and can withstand a wide range of environmental conditions. With its unique spiral fin design, it is able to provide maximum cooling performance and ensure safe and efficient operation in any application.
The specific data is subject to PDF, and the above content is for reference