ATS-01F-50-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.181" (30.00mm)
Width:	1.181" (30.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.590" (15.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	19.22°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Heat sinks are essential components for the efficient operation of any thermal system, as they are designed to provide a means by which heat can be dissipated from a particular device. The ATS-01F-50-C3-R0 is a heat sink that has been specifically designed for use with high performance CPUs and other components that require large amounts of thermal energy management. The heat sink uses a variety of techniques to ensure that it is able to provide exceptional cooling performance, as well as protection for the device that it is used in.The ATS-01F-50-C3-R0 is a heat sink that features an aluminum construction, which provides excellent thermal conductivity. This aluminum construction allows the sink to spread heat evenly throughout its surface area, ensuring that it does not contribute to thermal hotspots. The construction also allows the sink to be used in a variety of different configurations, ensuring that it can be used efficiently in any system.Another feature of the ATS-01F-50-C3-R0 heat sink is its optimized fin design. The fin design of this model is incredibly efficient, allowing for a wide range of possible cooling configurations. The fins are designed to be able to transfer heat rapidly away from the device that it is used in, allowing it to achieve much higher thermal performance than similar models on the market. This fin design also allows for greater airflow over the heat sink surface, allowing for improved cooling performance.The ATS-01F-50-C3-R0 also features an integrated shielding material. This material helps to reduce the stray emissions from the heat sink, resulting in a cleaner operating environment and fewer temperatures. This shielding material is designed to work synergistically with the fin design of the sink, allowing for greater levels of thermal efficiency. This shielding material also helps to reduce the noise emitted from the fan, ensuring that the device remains working at an optimal level.The ATS-01F-50-C3-R0 is also designed with a variety of other features in mind. These features include integrated power management capabilities, allowing for the management of the fan speed to make sure that the device is being cooled efficiently. The heat sink also includes an integrated heatsink base, which helps to ensure that the heat is spread evenly throughout the sink and that heat is not concentrated in certain areas. Finally, the heat sink includes an integrated mounting bracket, allowing for simpler installation.The ATS-01F-50-C3-R0 is ideal for those who are looking for a highly efficient heat sink for use with high performance and heat generating components. This heat sink features a lightweight and reliable aluminum construction, optimized fin design, integrated shielding material and various other features. These features ensure that the heat sink can provide excellent cooling performance while ensuring minimal environmental disturbances. With its various features, the ATS-01F-50-C3-R0 is the perfect choice for any system that requires efficient thermal management.

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