| Allicdata Part #: | ATS-01F-55-C1-R0-ND |
| Manufacturer Part#: |
ATS-01F-55-C1-R0 |
| Price: | $ 3.21 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X10MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-01F-55-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.92446 |
| 30 +: | $ 2.84550 |
| 50 +: | $ 2.68733 |
| 100 +: | $ 2.52926 |
| 250 +: | $ 2.37119 |
| 500 +: | $ 2.29216 |
| 1000 +: | $ 2.05503 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 23.94°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-01F-55-C1-R0 is a type of thermal-heat sink device that is designed to increase the thermal conductivity of a given system. This will ensure that heat can be dissipated more efficiently, and the overall temperature can be kept at a much more stable and comfortable level. In this article, we will discuss the mechanics of the ATS-01F-55-C1-R0, as well as its applications and its working principle.
A thermal-heat sink is a device that is used to increase the thermal conductivity of a particular system. Heat sinks are normally used to quickly cool down a given device or area by improving the flow of heat away from it. This can be beneficial for any kind of electronic system, as it can help prevent overheating and increase its overall efficiency. In the case of the ATS-01F-55-C1-R0, the heat-sink is designed to be used on either the external or internal electronics, depending on the situation. It is composed of a high-grade aluminum alloy, which is highly thermally conductive.
The ATS-01F-55-C1-R0 thermal-heat sink is designed to provide increased thermal conductivity and heat dissipation performance while remaining lightweight and compact. This heat-sink is made up of a base, fins, and a fan, all of which are made of high-grade aluminum alloy. The fins are curved in such a way to optimize air-flow and heat dissipation, while the fan helps to ensure optimal air velocity. In addition, the base of the sink is also designed to provide a better mounting for the components, which helps to further stabilize the overall temperature.
The ATS-01F-55-C1-R0 thermal-heat sink has numerous applications. It is most commonly used to improve the cooling performance of electronic devices. This is done by increasing the rate at which heat can be dissipated. Additionally, it can also be used for cooling computer components like CPUs, GPUs, and RAM. It can also be used in high-voltage applications like motors, transformers, or high-power converters.
The ATS-01F-55-C1-R0 thermal-heat sink works in a number of different ways. The fins are designed to increase air flow and optimize heat dissipation. This means that the heat will spread into the fins more quickly, allowing it to be dispersed more uniformly. The fan helps to further improve the air velocity and circulation. In addition, the base ensures that the components are securely mounted, and the aluminum alloy itself is highly thermally conductive.
In conclusion, the ATS-01F-55-C1-R0 is a type of thermal-heat sink device that is designed to increase the thermal conductivity of a given system. It is usually used to improve the cooling performance of electronics and help to maintain a comfortable temperature. The ATS-01F-55-C1-R0 is composed of a base, fins, and a fan, all of which are made of high-grade aluminum alloy. The fins are curved in such a way to optimize air-flow and heat dissipation, while the fan helps to ensure optimal air velocity, and the base provides extra stability and mounting for components. This thermal-heat sink is most commonly used to improve the cooling performance of electronic devices, but can also be used in high-voltage applications like motors, transformers, and high-power converters.
The specific data is subject to PDF, and the above content is for reference