ATS-01F-64-C2-R0 Allicdata Electronics
Allicdata Part #:

ATS3793-ND

Manufacturer Part#:

ATS-01F-64-C2-R0

Price: $ 4.56
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 40X40X25MM L-TAB T766
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-01F-64-C2-R0 datasheetATS-01F-64-C2-R0 Datasheet/PDF
Quantity: 1000
1 +: $ 4.13910
10 +: $ 4.02507
25 +: $ 3.80167
50 +: $ 3.57802
100 +: $ 3.35437
250 +: $ 3.13075
500 +: $ 2.90712
1000 +: $ 2.85122
Stock 1000Can Ship Immediately
$ 4.56
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.575" (40.00mm)
Width: 1.575" (40.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.984" (25.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 9.39°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Heat sinks are a thermally conductive device used to transfer heat away from the source. Heat will dissipate through radiation, convection, and conduction, however due to the effectiveness of a heat sink, conduction is considered the most efficient of these three. Heat sinks direct heat away from components and processes, dissipating it to maintain the temperature of the overall system at a low percentage of the full load potential. ATS-01F-64-C2-R0 is a typical example of a thermal-heat sink.

The ATS-01F-64-C2-R0 is a base-mounted series of thermal-heat sinks featuring an extruded aluminum profile design with a standard vent. This provides efficient cooling performance and maintains maximum transfer of heat away from required components. The ATS-01F-64-C2-R0 is capable of dissipating up to 64 Watts and is designed for use in applications where small form factor and minimal space requirement are essential such as host computers, communications racks, and power supplies.

The general working principle of ATS-01F-64-C2-R0 is the transfer of heat away from required components using heat sinks, hence providing the required cooling to the system. The basic heat dissipation structure of ATS-01F-64-C2-R0 consists of an extruded aluminum profile and a standardized vent. The heat is transferred through the aluminum profile from the source and dissipated by natural convection out of the vent. The natural convection process consists of heated air rising up due to lower density and cold air entering through the vent due to its high density. This process helps in maintaining the desired temperature of the overall system.

The ATS-01F-64-C2-R0 is ideal for applications that require a small, low-profile heat sink, and good cooling performance. The optimal level of airflow in these applications is 28 for up to 15 Watts, 22 for 15 to 28 Watts, and 16 for higher thermal loads. The specially designed vents provide lower air resistance compared to other products. This excellent performance is achieved without sacrificing the efficiency in the process, hence improving the stability of the overall system.

In addition, the ATS-01F-64-C2-R0 has the capacity to be used in environments at a wide temperature range. It is designed to perform at temperatures between -40 to +85 Celsius making it suitable for applications in various environments. Furthermore, it is corrosion-resistant and does not require any special maintenance. This makes it a reliable and durable product for all types of applications.

The ATS-01F-64-C2-R0 is therefore an ideal solution for applications requiring efficient heat dissipation performance in a small profile. It is designed to provide the best thermal performance while minimizing the associated space requirement. This heat sink is versatile and can be used in various applications, making it a sought-after product for any heating and cooling system.

The specific data is subject to PDF, and the above content is for reference

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