| Allicdata Part #: | ATS-01F-70-C3-R0-ND |
| Manufacturer Part#: |
ATS-01F-70-C3-R0 |
| Price: | $ 4.69 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X25MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-01F-70-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.22163 |
| 30 +: | $ 3.98727 |
| 50 +: | $ 3.75278 |
| 100 +: | $ 3.51823 |
| 250 +: | $ 3.28369 |
| 500 +: | $ 3.04914 |
| 1000 +: | $ 2.99050 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 8.79°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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A thermal heat sink is an electronic component designed to dissipate heat from other components. The ATS-01F-70-C3-R0 thermal heat sink is used mainly in power transistors and linear ICs, such as those used in switching power supplies. It is also used in audio amplifiers, power amplifiers and multiple stage tier amplifiers.
The ATS-01F-70-C3-R0 thermal heat sink is designed to provide maximum heat dissipation from these components. It features a four-heat-pipes structure and an ultra-thin profile. The four heat pipes are designed to conduct and dissipate heat away from the unit quickly and efficiently. This design is highly efficient at transferring the heat from the component to the thermal heat sink.
The thermal heat sink also features a unique “finger-printed” fin assembly. This helps to increase the surface area and allows for better thermal transfer from the component to the thermal heat sink. The unique design also creates an exhaust cavity which improve the thermal performance.
The ATS-01F-70-C3-R0 thermal heat sink is designed to be highly efficient and reliable. It is constructed from high-grade aluminum alloy, which provides excellent durability and thermal conductivity. The thermal heat sink is also designed to withstand extreme temperatures, and provides good protection against shock and vibration.
The ATS-01F-70-C3-R0 thermal heat sink offers excellent performance in a wide range of applications. It can be used in high-power switching supplies, RF amplifiers, power supplies, audio amplifiers, and multiple tier amplifiers. Additionally, it is suitable for very high-powered applications such as ultra-low harmonics and high temperature applications.
The ATS-01F-70-C3-R0 thermal heat sink is designed to be highly versatile and highly efficient. It provides excellent performance in a variety of applications. This thermal heat sink is ideal for use in high-power devices and circuits, where high reliability and performance are required.
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