| Allicdata Part #: | ATS-01F-72-C1-R0-ND |
| Manufacturer Part#: |
ATS-01F-72-C1-R0 |
| Price: | $ 4.43 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X35MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: | ATS-01F-72-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.99042 |
| 30 +: | $ 3.76887 |
| 50 +: | $ 3.54715 |
| 100 +: | $ 3.32545 |
| 250 +: | $ 3.10376 |
| 500 +: | $ 2.88206 |
| 1000 +: | $ 2.82664 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.378" (35.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 5.09°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heatsinks are widely used components in electrical and electronics appliances. They are necessary for thermal management, as they can dissipate heat from hotter components on the circuit board. The Heat Sink\'s main function is to dissipate heat away from the device or component, so that it doesn\'t get too hot and become a risk to other components. ATS-01F-72-C1-R0 is a special type of heatsink with tremendous cooling capabilities, designed for high-end consumer applications.
The ATS-01F-72-C1-R0 has a unique shape: a flat, shallow-angled panel that stands at 72 mm tall and 29 mm wide. This size and shape makes it ideal for installation in tight spaces, which makes it the perfect solution for consumer electronics products. The bottom of the panel is made up of a special copper heat spreader, which is a heat-transfering material that efficiently dissipates heat from the heated components. The heat spreader evenly distributes the heat to the panel\'s aluminum fins, providing an efficient cooling operation.
The panel is equipped with an advanced thermal control chip, optimized for accurate temperature management and temperature control. This allows the heat control module to efficiently and effectively manage the temperature of the panel and make temperature adjustments to ensure no overheating occurs. The thermal control chip also monitors the speed of the fan, so it can adjust accordingly for the best cooling performance. Fan speed can be adjusted manually or through an auto-tuning feature.
What sets the ATS-01F-72-C1-R0 apart from standard heatsinks is its unique fin-shape, which allows for greater airflows. The higher the airflow, the more cooling performance the heatsink provides. In addition, the larger surface area of the fins increases the heatsink\'s surface area and further enhances its thermal performance. Because of its unique shape, the ATS-01F-72-C1-R0 is perfect for applications in consumer electronics, such as gaming consoles and high-end media players.
The ATS-01F-72-C1-R0 is a reliable and efficient choice for a range of consumer applications, with its thermal management and heat dissipation capabilities, as well as its tailored design. With its sleek design and advanced cooling capabilities, the ATS-01F-72-C1-R0 heat sink is an excellent choice for cooling systems, high-end consumer products, and other applications.
The specific data is subject to PDF, and the above content is for reference
ATS-01F-72-C1-R0 Datasheet/PDF