| Allicdata Part #: | ATS-01F-72-C3-R0-ND |
| Manufacturer Part#: |
ATS-01F-72-C3-R0 |
| Price: | $ 5.15 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X35MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-01F-72-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.63806 |
| 30 +: | $ 4.38060 |
| 50 +: | $ 4.12297 |
| 100 +: | $ 3.86524 |
| 250 +: | $ 3.60755 |
| 500 +: | $ 3.34987 |
| 1000 +: | $ 3.28546 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.378" (35.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 5.19°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-01F-72-C3-R0 is one of the most widely used thermal-heat sinks available. It is commonly used in applications that require heat dissipation, such as computers, servers and other electronic devices. This device is designed to effectively spread heat away from the heated component as well as provide an efficient cooling solution.
The ATS-01F-72-C3-R0 is composed of chemical nickel-plated aluminum and is designed to operate with temperatures ranging from -35 degrees Celsius to +130 degrees Celsius. Its finned design ensures that there is enough surface area for air to flow over, drawing away heat. As the air passes over the fins, heat is absorbed and subsequently dissipated.
In order to work effectively, the ATS-01F-72-C3-R0 requires that it be mounted in a thermal-conductive manner. This increases its ability to dissipate heat, since the device can more easily absorb and spread the heat. The device also needs to be correctly sized in order to ensure that it can adequately spread and absorb the heat generated by the electronic components.
In addition to its finned design, the ATS-01F-72-C3-R0 also features a solid base which allows it to be securely mounted. This makes it suitable for mounting onto circuit boards such as motherboards and power supplies. The solid base also provides a stable and secure mounting surface, which helps prevent the device from vibrating or shifting during use.
The ATS-01F-72-C3-R0 is also highly efficient in terms of noise production. It produces minimal noise due to its low airflow design and its fin design ensures that the air remains relatively quiet as it passes over the device. This makes it suitable for applications where noise is a factor, such as in servers, workstations or other spaces where quiet operation is desired.
The ATS-01F-72-C3-R0 is also incredibly reliable and is widely used across a variety of applications. Its finned design provides users with a more efficient method of heat dissipation, while its solid base ensures that the device will remain securely mounted. overall, the ATS-01F-72-C3-R0 is an effective thermal-heat sink for a variety of applications, providing reliable and efficient heat dissipation.
The specific data is subject to PDF, and the above content is for reference