| Allicdata Part #: | ATS-01F-74-C3-R0-ND |
| Manufacturer Part#: |
ATS-01F-74-C3-R0 |
| Price: | $ 3.39 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X15MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-01F-74-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.07881 |
| 30 +: | $ 2.99586 |
| 50 +: | $ 2.82933 |
| 100 +: | $ 2.66295 |
| 250 +: | $ 2.49652 |
| 500 +: | $ 2.41329 |
| 1000 +: | $ 2.16364 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 20.62°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Introduction
The ATS-01F-74-C3-R0 is a thermal - heat sink solution designed for both industrial and consumer applications. It is widely used in computer and electronic products due to its heat-dissipation ability. This article will explain the application field and working principle of the ATS-01F-74-C3-R0.
Application Field
The ATS-01F-74-C3-R0 is designed for a wide variety of applications, including but not limited to:
- Computer components
- Electronic devices
- Industry automation
- Power distribution and switching
- Home appliances
- Security systems
- Industrial motor control
- HVAC (Heating, Ventilation, and Air Conditioning)
- Renewable energy
The ATS-01F-74-C3-R0 can be used in any of the above applications due its ability to dissipate heat quickly and efficiently. It is designed to dissipate heat quickly, thereby preventing components from overheating.
Working Principle
The ATS-01F-74-C3-R0 is designed to transfer heat away from the source. The device achieves this by dissipating heat away from its surface via conduction and convection. The device works on the principle of thermodynamics, where heat energy is transferred from a hotter area to a cooler area until thermal equilibrium is reached. Convection helps in the process, as it moves air over the device’s surface, taking heat with it.
The ATS-01F-74-C3-R0 features a large surface area, helping to dissipate more heat away from its source. The device features fins that direct air over the surface of the device, aiding in the convection process. This helps transfer heat away from the source quickly and efficiently.
The device also features an integrated heat spreader that helps to reduce the temperature of the device. The heat spreader is made up of a series of fins that help to evenly spread heat across the device’s surface. This helps to reduce the overall temperature of the device, ensuring that no individual component becomes too hot.
The ATS-01F-74-C3-R0 also features a special cooling system, which helps to reduce the temperature even further. The cooling system is designed to move air across the device, helping to cool it further and reduce the overall temperature of the device.
Conclusion
The ATS-01F-74-C3-R0 is a thermal - heat sink solution designed for a wide variety of applications. It is designed to transfer heat away from the source quickly by dissipating heat from its surface via conduction and convection. The device features a large surface area and an integrated heat spreader to help reduce its temperature, as well as a special cooling system to help further reduce its temperature.
The specific data is subject to PDF, and the above content is for reference