ATS-01F-81-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.181" (30.00mm)
Width:	1.181" (30.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.790" (20.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	14.22°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction to the ATS-01F-81-C3-R0

The ATS-01F-81-C3-R0 is a thermal management solution designed to maximize the efficiency of electronic components and systems. This device can help ensure that components remain relatively cool during prolonged usage and accelerate system performance. It is designed for use in a variety of electronic applications, such as in computers, kiosks, and industrial machines.

ATS-01F-81-C3-R0 Application Field

The ATS-01F-81-C3-R0 is designed for use in a wide variety of thermal management systems. This component is most commonly used in industrial and military equipment, where it is important that components and systems remain cool. Additionally, the ATS-01F-81-C3-R0 can be used in automotive, medical, and commercial applications, as well as in applications involving harsh environments.

ATS-01F-81-C3-R0 Working Principle

The ATS-01F-81-C3-R0 is a thermal management device that is designed to allow for efficient heat transfer. This device utilizes a combination of copper fins and a heat sink to provide a cost-effective, thermally efficient solution. The fins act as additional cooling surfaces, and help to dissipate heat from the underlying electronic components.The ATS-01F-81-C3-R0 is designed to provide excellent thermal performance and can be used in applications involving temperatures up to 125°C. This thermal management device is also designed to work with a range of operating environments, including both indoor and outdoor applications. Additionally, the ATS-01F-81-C3-R0 is designed for easy installation and maintenance, and can be mounted directly to a variety of surfaces, including steel, aluminum, PCBs, and plastic.

Conclusion

The ATS-01F-81-C3-R0 is an effective thermal management solution for electronic components and systems. It uses a combination of copper fins and a heat sink to provide excellent heat transfer and thermal protection at temperatures up to 125°C. The ATS-01F-81-C3-R0 is highly versatile and can be used in a variety of applications, including medical, military, and commercial. Additionally, the device is designed for easy installation and is optimized for use in both indoor and outdoor applications.

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