| Allicdata Part #: | ATS-01F-96-C1-R0-ND |
| Manufacturer Part#: |
ATS-01F-96-C1-R0 |
| Price: | $ 4.17 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X35MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-01F-96-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.79386 |
| 30 +: | $ 3.58323 |
| 50 +: | $ 3.37239 |
| 100 +: | $ 3.16159 |
| 250 +: | $ 2.95082 |
| 500 +: | $ 2.74005 |
| 1000 +: | $ 2.68736 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.378" (35.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 5.60°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are a type of passive thermal device used to increase the surface area available for heat transfer and improve the overall thermal performance of a system by dissipating heat faster. The ATS-01F-96-C1-R0 heat sink is a finned heat sink designed for high-performance applications requiring superior thermal performance. It is a highly efficient, cost-effective solution for cooling passive electrical and electronic components.
The ATS-01F-96-C1-R0 heat sink is made up of a base plate made from high-quality aluminum alloy that is machined to precise specifications. It is equipped with an array of plated aluminum fins that provide thermal contact with the components to be cooled while also increasing the surface area for more efficient heat transfer. The fins are designed to allow air or heat to flow freely through them, and the large surface area of the fins allows for better thermal conductivity.
The thermal management performance of the ATS-01F-96-C1-R0 heat sink is further enhanced by the use of an integrated fin cooling system. The fins are arranged in a layered design, with each layer forming a sealed chamber. Air is supplied to the layers and drawn off from the top, creating a continuous airflow over the fins that helps to dissipate heat away from the components to be cooled. This airflow helps to improve heat transfer efficiency and increases the overall cooling performance of the ATS-01F-96-C1-R0 heat sink.
The ATS-01F-96-C1-R0 heat sink is highly versatile and can be used in a variety of applications that require high levels of efficiency and reliability. It can be used for cooling power supplies, server racks, telecommunications systems, and consumer electronics devices. It is also ideal for use in applications that require high-power heat-dissipating components, such as industrial machines and automotive electronics.
The ATS-01F-96-C1-R0 heat sink is designed to provide superior thermal performance and reliability. The fins are made from high-strength aluminum alloy and are designed for long-term fatigue resistance. The heat sink features a one-piece construction and is highly resistant to corrosion, making it ideal for harsh environments. It also features a slim profile, making it easy to install in tight spaces. In addition, the heat sink is designed with a low mount-height profile, which allows for better air flow and cooling performance.
The ATS-01F-96-C1-R0 heat sink is a reliable and efficient thermal management solution that can be used in a variety of high-performance applications. Its robust construction, integrated design and slim profile make it an ideal choice for those looking for a cost-effective solution to their thermal management needs. With its superior thermal performance and low mount height, the ATS-01F-96-C1-R0 heat sink is an excellent choice for all your needs.
The specific data is subject to PDF, and the above content is for reference