| Allicdata Part #: | ATS-01G-09-C1-R0-ND |
| Manufacturer Part#: |
ATS-01G-09-C1-R0 |
| Price: | $ 3.49 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X20MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-01G-09-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.17394 |
| 30 +: | $ 3.08826 |
| 50 +: | $ 2.91677 |
| 100 +: | $ 2.74516 |
| 250 +: | $ 2.57363 |
| 500 +: | $ 2.48783 |
| 1000 +: | $ 2.23047 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.56°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is an important part in modern technology, especially within the electronics industry. Heat sinks are an important tool in providing reliable and efficient thermal management. The ATS-01G-09-C1-R0 is a type of heat sink that is designed to be used for a variety of applications. This article will explore the various application fields where the ATS-01G-09-C1-R0 can be successfully used and its working principle.
Application Fields
The ATS-01G-09-C1-R0 heat sink is primarily designed for applications with components that generate a significant amount of heat in a relatively small space. This heat sink is conveniently sized to fit in tight spaces and is well-suited for applications with limited space. One of the major advantages of this heat sink is that it is lightweight and can be mounted easily, making it ideal for applications that would normally require multiple separate heat sinks.
The ATS-01G-09-C1-R0 is also capable of providing effective thermal management for automotive, industrial and scientific applications. It is especially suitable for applications that require cooling of motors, power electronics, and circuit protection devices. Furthermore, this heat sink is also robust enough to withstand hostile environments, making it suitable for applications in harsh temperatures.
Working Principle
The ATS-01G-09-C1-R0 heat transfer capabilities are provided by an advanced pin fin design that maximizes surface area to increase heat dissipation. This innovative design also creates a narrow profile that provides ample airflow to enhance heat transfer. The heat sink also features a high-temperature adhesive backing that ensures secure mounting and superior thermal conductivity.
Additionally, the ATS-01G-09-C1-R0 utilizes advanced copper material to provide additional heat transfer capabilities. The copper material helps to absorb and dissipate the heat generated to provide reliable cooling of your components. This heat sink also utilizes an anodized finish to provide corrosion resistance, extending the life and effectiveness of the heat sink.
The ATS-01G-09-C1-R0 is designed and constructed to provide reliable thermal management capabilities. This heat sink is an excellent choice for a variety of applications including automotive, industrial, and scientific applications. It is lightweight and can be mounted easily, and its innovated pin fin design maximizes surface area and airflow for improved heat transfer. Furthermore, the advanced copper material and anodized finish increases the performance and extends the life of the heat sink.
The specific data is subject to PDF, and the above content is for reference