| Allicdata Part #: | ATS3838-ND |
| Manufacturer Part#: |
ATS-01G-10-C2-R0 |
| Price: | $ 4.19 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X25MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-01G-10-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.80520 |
| 10 +: | $ 3.70125 |
| 25 +: | $ 3.49574 |
| 50 +: | $ 3.29011 |
| 100 +: | $ 3.08448 |
| 250 +: | $ 2.87885 |
| 500 +: | $ 2.67322 |
| 1000 +: | $ 2.62181 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.89°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Heat sinks are thermal solutions used to dissipate heat generated by electronic components or systems by transferring the heat to a more thermally dissipative material, often air or water. ATS-01G-10-C2-R0 is a high-performance thermal solution designed to maintain a cool running temperature even in the most demanding applications. Its main application fields and working principles are discussed in this article.
Application fields
ATS-01G-10-C2-R0 is primarily used in high-performance computing systems, telecommunications, I/O devices, consumer and industrial electronics, medical and dental applications, etc. The aluminum construction of the heat sink makes it capable of dissipating the heat generated by the components, thus preventing premature damage due to overheating. It also dissipates heat at a rapid rate, allowing components to run cooler and ultimately, more effectively.
Design
The design of ATS-01G-10-C2-R0 allows for maximal surface area contact between the fins and the components. This provides the greatest possible thermal contact, allowing for more rapid heat dissipation. The heat sink itself is composed of an aluminum base, a thermally conductive material, a copper-plated copper heat spreader, and numerous aluminum fins.
Heat Transfer
The primary method of heat transfer utilized by ATS-01G-10-C2-R0 is convection. Heat generated by the components is transferred to the aluminum base, then travels through the thermally conductive material to the copper-plated copper heat spreader. This spreader expedites the conduction and transfers the heat to the aluminum fins, which then dissipate the heat to the surrounding environment through convection.
Other Features
In addition to its exemplary heat transfer capabilities, ATS-01G-10-C2-R0 also features a robust mechanical design and is UL certified. This makes it an ideal solution for those looking for a high-performance, reliable, and safe thermal solution. It also features an advanced fan design that can be adjusted to fit the various configurations of individual application.
Conclusion
ATS-01G-10-C2-R0 is an optimal thermal solution for a variety of applications. Its convection-based heat transfer approach and robust mechanical design make it an ideal choice for those looking for an efficient, reliable, and safe thermal solution. Its UL certification further provides assurance that the product is of the highest possible quality and performance.
The specific data is subject to PDF, and the above content is for reference