| Allicdata Part #: | ATS-01G-131-C1-R0-ND |
| Manufacturer Part#: |
ATS-01G-131-C1-R0 |
| Price: | $ 4.16 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 60X60X20MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-01G-131-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.78252 |
| 30 +: | $ 3.57231 |
| 50 +: | $ 3.36206 |
| 100 +: | $ 3.15195 |
| 250 +: | $ 2.94182 |
| 500 +: | $ 2.73169 |
| 1000 +: | $ 2.67917 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.362" (60.00mm) |
| Width: | 2.362" (60.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 3.58°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are an integral component for a variety of industrial and commercial applications. They help disperse heat from electronic components and other materials, thus preventing them from becoming too hot and malfunctioning. The ATS-01G-131-C1-R0 is one such heat sink product, designed with air venting, high thermal conductivity and excellent thermal efficiency in all types of environments.
The ATS-01G-131-C1-R0 is a high performance, low profile heat sink with an impressive thermal resistance grade of 1.0. The design allows easy air ventilation from both the front and rear sides. It is designed to provide a large space for venting, thus aiding in the dissipation of heat. The design also incorporates a built-in air balance diaphragm, which helps maintain the air pressure for better heat dissipation.
The product is also designed with an ultra-high thermal conductivity layer, which is formed by anodizing aluminum and adding diamond particles. This ensures efficient removal of heat and efficient heat absorption. The product also features reflective panels that direct heat away from other components and keeps the surface cooler. These panels are also self-adhesive, which makes them easy to assemble.
The ATS-01G-131-C1-R0 also features patented air coolers that help keep the heat sink cooler. The fanless design helps reduce noise and ensures heat dissipation over a wide area. The product is also designed with "soft-touch" technology, which helps ensure that the edges do not touch the chip on which the heat sink is mounted.
The ATS-01G-131-C1-R0 has a variety of applications, including the cooling of graphene devices, high-end graphics cards and printed circuit boards in gaming systems. In addition, it is also used in solar energy systems, as well as in mobile devices. It can also be used in heat exchangers and in cooling systems for large equipment.
Overall, the ATS-01G-131-C1-R0 is an ideal choice for a variety of applications where efficient thermal management is required. The product is reliable and easy to install, and offers great performance with a low profile. Its advanced design ensures effective heat dissipation and efficient thermal control, making it an ideal choice for a wide range of applications.
The specific data is subject to PDF, and the above content is for reference