| Allicdata Part #: | ATS-01G-15-C3-R0-ND |
| Manufacturer Part#: |
ATS-01G-15-C3-R0 |
| Price: | $ 4.33 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 50X50X25MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-01G-15-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.89781 |
| 30 +: | $ 3.68151 |
| 50 +: | $ 3.46487 |
| 100 +: | $ 3.24834 |
| 250 +: | $ 3.03178 |
| 500 +: | $ 2.81523 |
| 1000 +: | $ 2.76109 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.969" (50.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.52°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-01G-15-C3-R0 is a thermal - heat sink solution for electronic equipment in a variety of industries. This thermal solution is designed to disperse heat evenly throughout its surface by using finned aluminum construction. The fins of the aluminum construction also enable efficient heat dissipation through a natural dissipation of heat in the air around the air-cooled equipment. This thermal solution is an excellent choice for applications in data and telecommunications, defense and aerospace, medical equipment, and industrial control systems.
The ATS-01G-15-C3-R0 works on the principle of convection. Heat is conducted from the device\'s hot metal parts (such as processor chips and memory components) up through the thermal medium, which is typically composed of copper or aluminum. The large surface area of the fins of the thermal medium creates a large number of air pockets, allowing the heat to escape into the atmosphere more effectively. This process of heat transfer can be optimized by using various air-moving devices, such as fans or ventilators, to ensure efficient heat dissipation over the entire surface area of the cooling system.
The ATS-01G-15-C3-R0 has several features that make it perfect for many kinds of applications. It is designed to fit most types of areas, with a specialized shape that is designed to fit into areas where space may be limited. It also has high levels of thermal dissipation, as well as high levels of heat resistance. Additionally, the finned design ensures maximum performance by providing a large surface area for efficient thermal dissipation. The large air pockets also ensure that the temperature during operation stays within a safe range.
The ATS-01G-15-C3-R0 is suitable for all kinds of electronics applications, ranging from telecommunications to data analytics and from medical to industrial control systems. It is an ideal solution for any application requiring low-noise, high performance, and reliable thermal dissipation. The thermal solution ensures a reliable way to keep electronics running at an optimal temperature for reliable performance and superior energy efficiency. It is also extremely reliable and easy to install, making it an ideal solution for a wide range of electronics applications.
The specific data is subject to PDF, and the above content is for reference