| Allicdata Part #: | ATS-01G-153-C3-R0-ND |
| Manufacturer Part#: |
ATS-01G-153-C3-R0 |
| Price: | $ 3.91 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X10MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-01G-153-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.55131 |
| 30 +: | $ 3.35370 |
| 50 +: | $ 3.15643 |
| 100 +: | $ 2.95917 |
| 250 +: | $ 2.76189 |
| 500 +: | $ 2.56462 |
| 1000 +: | $ 2.51530 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 12.06°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks
The ATS-01G-153-C3-R0 is a unique thermal transfer device used to dissipate heat from environments where there are not enough naturally occurring thermal currents (or convection) to do it. This type of Heat Sink has been developed as an alternative to fan-cooled Heat Sinks, which are faster but also louder and more expensive. The ATS-01G-153-C3-R0 is designed to provide quiet and efficient cooling. It is ideal for cooling processors, video cards, power supplies, and other electronics.
Application Field
The ATS-01G-153-C3-R0 is used in a variety of applications, such as power electronics, computer peripherals, telecoms, medical equipment, and LED lighting. The device has a wide range of thermal transfer properties, making it suitable for any environment. Its unique design keeps the mounting points of components outside of the thermal area, providing a secure and easy way to install the Heat Sink. The ATS-01G-153-C3-R0 also features a low thermal resistance design that ensures maximum efficiency.
The Heat Sink is designed to resist the toughest conditions. It is made using high-grade alloys and can handle temperatures up to 150°C. It is compliant with Industrial Standard regulations and has an operating temperature range of -40°C to +150°C. The device also has an excellent thermal conductivity and can dissipate heat quickly and uniformly.
Working Principle
The ATS-01G-153-C3-R0 uses a patented micro-hole technology, in which heat is drawn away from the heat source by small holes in the surface of the aluminum material. The technology increases efficiency, as the heat can dissipate quickly from the device even in low thermal current environments. The design also ensures that the hot air is not drawn back into the system, which increases the efficiency of the fan cooling.
The unique design of the ATS-01G-153-C3-R0 also helps increase the efficiency of the thermal transfer process. The device has an advanced louvered design which works to increase air flow in environments with low levels of convection. The louvers create more space for air to pass through, which increases the amount of heat dissipated away from the circuit board.
The ATS-01G-153-C3-R0 is a perfect thermal transfer device for use in any environment. It is highly efficient and quick to install, making it an ideal solution for any heating or cooling application.
The specific data is subject to PDF, and the above content is for reference