| Allicdata Part #: | ATS-01G-159-C3-R0-ND |
| Manufacturer Part#: |
ATS-01G-159-C3-R0 |
| Price: | $ 4.17 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X10MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-01G-159-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.79386 |
| 30 +: | $ 3.58323 |
| 50 +: | $ 3.37239 |
| 100 +: | $ 3.16159 |
| 250 +: | $ 2.95082 |
| 500 +: | $ 2.74005 |
| 1000 +: | $ 2.68736 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.78°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is a crucial aspect of many computer designs. Proper cooling is essential to prevent overheating and ensure optimal operation. Heat sinks are a common cooling tool used to distribute heat away from sensitive electronic components, allowing them to operate at their required temperatures. The ATS-01G-159-C3-R0 heat sink is an advanced heat sink that can be used to effectively dissipate heat in even the most challenging environments.
The ATS-01G-159-C3-R0 is a high-performance, low-noise thermal solution designed to dissipate large amounts of heat from sensitive components in computer designs. It features a large footprint surface that covers a wide variety of components in which heat must be efficiently and reliably dissipated. The heat sink features a unique combination of both heat spreader and fins that provide a larger area of heat dissipation ensuring that the components remain cool even under heavy load.
The ATS-01G-159-C3-R0 has a unique design that combines fins and a heat spreader. This allows for a high performance and efficient heat removal due to the large surface area of the fins which spreads heat away from the concentrated area of the component. The fin design also ensures a quiet operation, as the fan on the heat sink draws in cooler air while pushing hot air away from the component. The heat sink also utilizes a copper base that provides an effective conductive path for dissipating heat away from the components.
In addition to these features, the ATS-01G-159-C3-R0 also utilizes a unique air flow pattern. This ensures that the heat is able to be efficiently distributed across the entire surface of the heat sink, ensuring maximum heat dissipation. The fan on the heat sink itself works to ensure that hot air is directed away from the component while cooler air is drawn in. This air flow pattern ensures quiet operation and an efficient heat dissipation.
The ATS-01G-159-C3-R0 is ideal for a wide variety of applications, including servers and workstations, where efficient heat removal is essential. It is also a good choice for consumer electronics, where reliable and quiet cooling is required. This heat sink can be used in both air-cooled and liquid-cooled systems and is designed for long life and reliability.
Heat sinks such as the ATS-01G-159-C3-R0 are an essential part of Thermal management in modern computing environments. Their design comfort of use both efficient heat removal as well as quiet operation, making them ideal for applications where both of these features are desired. ATS-01G-159-C3-R0 heat sinks are reliable, efficient, and quiet solutions for any computing environment that require efficient, reliable, and silent heat dissipation.
The specific data is subject to PDF, and the above content is for reference