ATS-01G-164-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.772" (45.00mm)
Width:	1.772" (45.00mm)
Diameter:	--
Height Off Base (Height of Fin):	1.378" (35.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	2.39°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction

The ATS-01G-164-C1-R0 is the latest in a range of thermal-heat sinks specifically designed to remove excess heat from applications requiring superior cooling performance. Thermal-heat sinks are commonly used in a wide range of electronic applications, from computers and consumer electronics devices to medical laboratory equipment. The ATS-01G-164-C1-R0 offers improved performance over its predecessors by taking advantage of advanced materials and design techniques to achieve improved thermal management and increased heat dissipation efficiency. The ATS-01G-164-C1-R0 also offers other features such as high resistance to corrosion, vibration and shock, as well as a range of mounting options.

Application Field

The ATS-01G-164-C1-R0 heat sink is generally used in the field of thermal management applications. By lowering operating temperatures, this heat sink offers improved system reliability and extends system life. It is ideal for use in applications requiring superior cooling performance such as high-power electronics, automotive electronics, laser diodes, power transistors, and high-powered amplifiers. It can also be used in medical and laboratory applications where precise temperatures must be maintained.

Working Principle

The ATS-01G-164-C1-R0 relies on the natural principle of convection to transfer the heat away from the electronics components. The thermal-heat sink design consists of a base layer consisting of aluminum or copper cladding, with fins or ribs extending from the base layer. The fins or ribs are designed to maximize the surface area of the heat sink in order to increase thermal dissipation efficiency. Heat is conducted away from the hot source by aluminum and copper surfaces, which in turn transfer the heat to the surrounding air and environment. The heat is then dissipated into the environment, which helps to lower the temperature of the heat sink and the surrounding environment.

Material and Finish

The ATS-01G-164-C1-R0 is constructed from aluminum or copper using a patented electro-forming process. The electro-forming process involves the application of an electro-etching current to the aluminum or copper material, creating an oxide layer that acts as an insulation barrier. This oxide layer provides improved heat transfer and thermal dissipation efficiency and improved resistance to corrosion. The finish of the heat sink is black anodized, providing superior resistance to corrosion, vibration, and shock and increased environmental protection.

Design

The ATS-01G-164-C1-R0 features a compact, space-saving design perfect for applications with limited space availability. It is designed to fit in a wide range of standard configurations, including square or rectangular shapes as well as circular, C-shape and U-forms. The fins or ribs are designed to maximize the surface area in order to increase the efficiency of the thermal management and cooling process. The design also features reinforced mounting points for greater structural integrity, and the ribbed aluminum base layer is designed to disperse heat more evenly and eliminate hot spots.

Installation

The ATS-01G-164-C1-R0 can be installed easily using a variety of methods, including screws, rivets, nuts and bolts. The heat sink comes complete with mounting hardware, and installation instructions are provided for easy fitting. The heat sink can also be mounted to the top of the PCB, or directly to the chassis or other heat dissipation solution.

Conclusion

The ATS-01G-164-C1-R0 is a superior thermal-heat sink for applications requiring superior cooling performance. It is designed to increase thermal management and improve heat dissipation efficiency, as well as providing high resistance to corrosion, vibration and shock. The compact design and easy installation make it ideal for applications with limited space availability, while the reinforced mounting points provide greater structural integrity. The thermal-heat sink is the perfect solution for a wide range of electronic applications requiring superior cooling performance.

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