ATS-01G-20-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-01G-20-C3-R0-ND

Manufacturer Part#:

ATS-01G-20-C3-R0

Price: $ 4.67
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 54X54X25MM XCUT T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-01G-20-C3-R0 datasheetATS-01G-20-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 4.19895
30 +: $ 3.96543
50 +: $ 3.73225
100 +: $ 3.49896
250 +: $ 3.26570
500 +: $ 3.03243
1000 +: $ 2.97412
Stock 1000Can Ship Immediately
$ 4.67
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 2.126" (54.01mm)
Width: 2.126" (54.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.984" (25.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 7.21°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management is an important factor to consider when designing and manufacturing a wide variety of electrical components and systems. In addition to the electronics, thermal management must also take into consideration the surrounding environment and the conditions in which the equipment or system will operate. Heat sinks help to reduce thermal stress in these environments, and facilitate the efficient cooling of electrical components and systems. The ATS-01G-20-C3-R0 heat sink is one such device that is widely used in a variety of applications.

The ATS-01G-20-C3-R0 is a thermally-driven aluminum heat sink that is 20 mm thick. It was designed with a combination of features that enable it to effectively dissipate heat in a wide range of ambient temperatures. It is made up of multiple layers of extruded aluminum fins that provide optimal thermal resistance. The fins contain thin channels that allow air to pass freely over them, enabling them to quickly and efficiently transfer heat away from the heat source.

The ATS-01G-20-C3-R0 has a compact design that makes it suitable for a wide variety of applications. It is an ideal choice for cooling electrical components in high-performance power electronics, server systems, and consumer electronics. It is also suitable for applications in automotive, military, and telecommunications systems. In addition to its use in cooling electronics, the ATS-01G-20-C3-R0 can also be used to cool heaters, radiators, and other thermal components.

The wide range of application fields and the effectiveness of the ATS-01G-20-C3-R0 as a thermal management solution are thanks to its efficient working principle. Heat is generated by the equipment and then transferred away from the component or system to the ATS-01G-20-C3-R0. The fins of the ATS-01G-20-C3-R0 are designed in such a way as to create a low air resistance that allows air to flow freely over the fins. This facilitates the cooling of the electronics and helps to protect against thermal stress.

The ATS-01G-20-C3-R0 is a reliable and effective thermal management solution for a variety of applications. It is a cost-effective and easy to install solution that helps to reduce thermal stress and increase the efficiency of the system. Its wide range of applications and efficient working principle make it an ideal choice for a wide range of applications.

The specific data is subject to PDF, and the above content is for reference

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