ATS-01G-200-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-01G-200-C1-R0-ND

Manufacturer Part#:

ATS-01G-200-C1-R0

Price: $ 3.25
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 50X50X10MM XCUT
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-01G-200-C1-R0 datasheetATS-01G-200-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 2.94840
30 +: $ 2.86860
50 +: $ 2.70925
100 +: $ 2.54986
250 +: $ 2.39047
500 +: $ 2.31079
1000 +: $ 2.07174
Stock 1000Can Ship Immediately
$ 3.25
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.969" (50.00mm)
Width: 1.969" (50.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.394" (10.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 9.76°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal - Heat Sinks are a critical component of many electronic systems. The ATS-01G-200-C1-R0 is a high-quality heat sink that is designed to help manufacturers and engineers improve system performance and reliability. In this article, we\'ll discuss the application field and working principle of the ATS-01G-200-C1-R0 heat sink.The ATS-01G-200-C1-R0 is designed for use in a variety of applications, including computer motherboards, telecommunications systems, networking applications, and automotive systems. This makes it an ideal choice for applications where heat dissipation is critical. The ATS-01G-200-C1-R0 also features a low-profile design, which allows it to fit into tight spaces.The ATS-01G-200-C1-R0 utilizes an advanced heat dissipation technology known as Vapor Chamber technology. The vapor chamber is a heat-conductive metal plate that is suspended within a vacuum chamber. It is the combination of the vapor chamber and the surrounding vacuum that enables the unit to effectively dissipate heat away from components.The vapor chamber works by trapping heat within the chamber and allowing the heat to be conducted away from components and then into the surrounding air. The vapor chamber creates a three-dimensional thermal profile, allowing heat to be conducted away from components more quickly and efficiently. Additionally, the chamber contains air pockets that act as a buffer, enabling the ATS-01G-200-C1-R0 to dissipate heat more effectively than traditional heat sinks.The efficiency of the ATS-01G-200-C1-R0 heat sink is further enhanced by a full-copper base plate that is designed to optimize surface contact and thermal dissipation. The copper base plate also helps to reduce the possibility of damaging components due to heat-induced oxidation. Additionally, the copper base plate also allows the ATS-01G-200-C1-R0 to be more easily installed than traditional heat sinks.The ATS-01G-200-C1-R0 is designed to be powerful enough to cool components in the hottest confined spaces. It is able to dissipate up to 200 W of heat, which is more than enough for most applications. Additionally, the ATS-01G-200-C1-R0 is designed to be reliable and durable, with a design that is resistant to vibration and shock.In conclusion, the ATS-01G-200-C1-R0 is an ideal solution for applications that require efficient heat dissipation. With its advanced vapor chamber technology, full-copper base plate, and durable design, it offers superior performance and reliability compared to traditional heat sinks.

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