| Allicdata Part #: | ATS3953-ND |
| Manufacturer Part#: |
ATS-01G-204-C2-R0 |
| Price: | $ 4.29 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X12MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-01G-204-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.89970 |
| 10 +: | $ 3.79386 |
| 25 +: | $ 3.58319 |
| 50 +: | $ 3.37239 |
| 100 +: | $ 3.16159 |
| 250 +: | $ 2.95082 |
| 500 +: | $ 2.74005 |
| 1000 +: | $ 2.68736 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.472" (12.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.43°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal management of electronic devices is an important factor when it comes to their performance, durability, and longevity. Heat must be effectively managed and removed from the device or component in order to prevent damage or inefficient operation. Heat sinks are designed to do just that by transferring the heat away from the component or device, and dissipate the heat out into the environment. One popular heat sink product is the ATS-01G-204-C2-R0, which is specifically designed for managing the heat generated from high-performance semiconductor devices. In this article, we’ll discuss the application field and working principle of the ATS-01G-204-C2-R0.
The ATS-01G-204-C2-R0 is a very efficient thermal management product designed for high-powered semiconductor devices. This particular heat sink is compatible with an 8mm diameter semiconductor package with a 0.4mm pin pitch. It boasts an excellent thermal resistance rating of 0.179°C/W, meaning it can handle a high amount of heat without damaging the device or affecting its performance.
The ATS-01G-204-C2-R0 features a copper base for efficient heat transfer. This copper base is covered with a thin aluminum oxide layer, which helps to protect the copper from oxidation and improve its ability to conduct heat. The heat transfer from the copper base is then dissipated out into the environment via a robust aluminum extrusion body. The aluminum extrusion body features a series of fins that effectively dissipate heat away from the device, helping keep temperatures in check.
In addition, the ATS-01G-204-C2-R0 also features a choice of mounting options for easy installation. This includes spring clips for self-regulating and simple variable clips for extra control. With these mounting options, the heat sink can be quickly and easily installed onto any compatible device.
The ATS-01G-204-C2-R0 is an ideal choice for managing high-powered semiconductor devices, as it offers excellent thermal resistance and reliable performance. The efficient heat transfer ability of the copper base, combined with the robust aluminum extrusion body, make it a great choice for applications where the heat generated must be safely dissipated away from the device. Furthermore, the choice of mounting options make it easy to install onto any compatible device.
Overall, the ATS-01G-204-C2-R0 is an excellent choice for thermal management applications. It offers excellent thermal resistance and an efficient heat transfer system, making it a reliable and efficient heat sink for managing high-powered semiconductor devices.
The specific data is subject to PDF, and the above content is for reference