ATS-01G-26-C3-R0

Thermal management is a critical component of product design and critical to the successful operation of any electronic device. Heat is the main source of device failure, as it affects the performance, accuracy, and durability of a device. Heat sinks are an effective way to dissipate heat and protect against heat-related damage. The ATS-01G-26-C3-R0 heat sink is a state-of-the-art heat sink designed to transfer heat away from electronic components such as CPUs, GPUs, and FPGAs.

The ATS-01G-26-C3-R0 is designed for use in applications where cooling is critical, such as computer servers, industrial machinery, and telecommunications equipment. Its high-performance heat-dissipating aluminum fins, coupled with its high-grade, light-weight extrusion technology, design, and highly efficient heat dissipation make it an ideal choice for the most demanding thermal control applications. The ATS-01G-26-C3-R0 heat sink includes a wide array of features and benefits to meet the needs of the most demanding user.

The ATS-01G-26-C3-R0 heat sink is constructed of an all-aluminum construction that features high-grade aluminum fins with a 0.25mm fin pitch which maximizes the heat dissipation surface area and increases heat-dissipating capacity. Its non-orientation fin design reduces thermal stress and drag for improved thermal efficiency. Its rapidly evaporating aluminum base with a 0.4mm fin height is designed to suck heat away from the CPU quickly and effectively. A pre-drilled mounting hole in the base of the heat sink provides easy installation.

The ATS-01G-26-C3-R0 heat sink is designed to work in two modes: convective cooling and fan-based cooling. Convective cooling uses the natural circulation of air created by warm air rising and cooler air sinking enabling the heat exchange process. Fan-based cooling utilizes a fan to circulate air and further support the cooling process.

Richco ATS-01G-26-C3-R0 heat sinks are made in a range of sizes and available in a variety of shapes including circular, rectangular, and square shapes. They are designed to fit into tight spaces and can be mounted anywhere on the board, which makes them an excellent choice for any application that requires a small, efficient heat sink. In addition, these heat sinks can be customized with different fan mounting types, fan sizes, and air speeds.

The ATS-01G-26-C3-R0 heat sink is designed to provide maximum cooling performance and reliability. Its thermal performance is attainable with its high-grade aluminum fins and extrusion design. The highly efficient heat dissipation of the ATS-01G-26-C3-R0 heat sink is also achieved by its low-pressure, high-velocity air-flow and its multiple fan mountings. Therefore, the ATS-01G-26-C3-R0 heat sink is the ideal choice for applications where cooling is critical.