ATS-01G-27-C2-R0 Allicdata Electronics
Allicdata Part #:

ATS3966-ND

Manufacturer Part#:

ATS-01G-27-C2-R0

Price: $ 7.71
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 70X70X12.7MM XCUT T766
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-01G-27-C2-R0 datasheetATS-01G-27-C2-R0 Datasheet/PDF
Quantity: 1000
1 +: $ 6.94260
10 +: $ 6.75486
25 +: $ 6.37963
50 +: $ 6.00440
100 +: $ 5.62918
250 +: $ 5.25390
500 +: $ 4.87862
1000 +: $ 4.78480
Stock 1000Can Ship Immediately
$ 7.71
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 2.756" (70.00mm)
Width: 2.756" (70.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.500" (12.70mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 12.24°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

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Heat sinks are an essential part of many electronic and electrical systems. The ATS-01G-27-C2-R0 is a special type of heat sink that is designed to regulate the temperature of electronic components. This heat sink is used in both industrial and commercial applications, providing a reliable thermal management system for equipment. This article will provide a brief overview of the application fields for the ATS-01G-27-C2-R0, as well as its working principle.

The ATS-01G-27-C2-R0 is designed to work with most standard power supplies that range from 12V to 24V. It is most commonly used in industrial and commercial applications such as arc welding, laser marking, and plasma cutting machines. It is also used in medical equipment, military equipment, and satellite equipment. Additionally, the ATS-01G-27-C2-R0 is often used in temperamental applications such as automotive testing, electrical power generation, and oil-free systems.

The main function of the ATS-01G-27-C2-R0 is to protect electronic components from being damaged by excessive heat. This is done by increasing the surface area of the component, which allows heat to dissipate more easily. The ATS-01G-27-C2-R0 is constructed from a mixture of aluminum, copper, and other metal alloys which helps to increase its thermal conductivity. Additionally, the ATS-01G-27-C2-R0 is designed to provide a reliable and secure fit for a variety of components or circuit boards, ensuring that it does not cause any short-circuits or other damage.

The ATS-01G-27-C2-R0 works using a combination of physics and thermodynamics. When heat is applied to a component, it begins to radiate, or disperse, the heat away from the component. The ATS-01G-27-C2-R0 works by absorbing and radiating away the heat, in turn cooling the component. Additionally, the ATS-01G-27-C2-R0 is also designed to flow the heat away from the component by convection using a combination of air and liquid cooling. By using air and liquid cooling together, the ATS-01G-27-C2-R0 can ensure that components are kept at a stable temperature, providing optimal performance and reliability.

The ATS-01G-27-C2-R0 is designed to provide a reliable and efficient thermal management system for electronic components. With its ability to cool components without having to rely on a separate cooling system, the ATS-01G-27-C2-R0 is an ideal choice for industrial and commercial applications. Additionally, the ATS-01G-27-C2-R0 is easy to install, making it a cost-effective solution for keeping electronic components running at peak performance. In summary, the ATS-01G-27-C2-R0 provides an effective and reliable solution for thermal management and is suitable for a variety of industrial and commercial applications.

The specific data is subject to PDF, and the above content is for reference

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