| Allicdata Part #: | ATS-01G-30-C3-R0-ND |
| Manufacturer Part#: |
ATS-01G-30-C3-R0 |
| Price: | $ 8.13 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 70X70X25MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-01G-30-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 7.31934 |
| 30 +: | $ 6.88861 |
| 50 +: | $ 6.45813 |
| 100 +: | $ 6.02759 |
| 250 +: | $ 5.59705 |
| 500 +: | $ 5.48941 |
| 1000 +: | $ 5.38177 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.756" (70.00mm) |
| Width: | 2.756" (70.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 5.35°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management plays a crucial role in the operation of any electronic device or system. Heat sinks are vital components for maintaining optimum performance and reliability of electronic systems under normal working conditions. ATS-01G-30-C3-R0 is an example of a thermal-heat sink solution that is cost effective, efficient and reliable in providing quality cooling solutions.
The ATS-01G-30-C3-R0 thermal-heat sink is designed as a two-phase solution. It features a solid cold plate coupled with a aluminum heat spreader for providing improved temperature performance. The thermal-heat sink comes with a highly conductive pressing method for dissipating the heat. The cold plate has an embedded thermal transducer that is used to monitor and control the performance of the thermal-heat sink.
The ATS-01G-30-C3-R0 thermal-heat sink is suitable for applications that require high thermal performance. It is an ideal solution for cooling high-power CPUs, GPUs, FPGAs, DSPs and ASICs. It is designed to provide reliable cooling performance for high-powered components even in critical environmental conditions. The advanced design of the thermal-heat sink helps to reduce the total power dissipation of the system. It also significantly reduces the operating temperature of the components.
The ATS-01G-30-C3-R0 thermal-heat sink offers a variety of features that make it an efficient and reliable solution for thermal management. The heat spreader has a V-shape groove that can be used for attaching and profiling the plates. This ensures that the thermal-heat sink is aligned with the device to ensure maximum efficiency. The thermal-heat sink also features a hole-patterned surface for improved heat dissipation. This ensures that the heat generated by the components is evenly distributed, resulting in improved thermal performance.
The ATS-01G-30-C3-R0 thermal-heat sink is a cost effective solution for thermal management of a wide range of electronic components. It is designed to provide reliable and energy-efficient cooling solutions for systems with components that operate at high temperatures. The innovative design and features of the thermal-heat sink ensure that the components are kept at optimal temperatures, thereby maintaining the performance and reliability of the system.
The specific data is subject to PDF, and the above content is for reference