ATS-01G-46-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-01G-46-C3-R0-ND

Manufacturer Part#:

ATS-01G-46-C3-R0

Price: $ 3.51
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 25X25X25MM L-TAB T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-01G-46-C3-R0 datasheetATS-01G-46-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.18591
30 +: $ 3.09981
50 +: $ 2.92774
100 +: $ 2.75549
250 +: $ 2.58325
500 +: $ 2.49714
1000 +: $ 2.23882
Stock 1000Can Ship Immediately
$ 3.51
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 0.984" (25.00mm)
Width: 0.984" (25.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.984" (25.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 11.84°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

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Thermal - Heat Sinks have been around for quite some time, and with the invention of new and improved methods of heat transfer they have become even more important in the modern age. The ATS-01G-46-C3-R0 is an example of a thermal heat sink, and this article will be exploring its application fields and working principles.

A thermal heat sink is a metallic object that is used to dissipate heat away from a component or surface. The ATS-01G-46-C3-R0 is a specific type of thermal heat sink that stands out due to its flexible application and cost-effectiveness. It is made from an aluminum material that is highly conductive and its size is remarkable for its heat dissipation capability. This heat sink is ideal for applications that require high levels of dissipation such as electronic equipment, amplifiers and power supplies. It can also be used as a component for cooling systems such as air conditioners and fans.

The ATS-01G-46-C3-R0 is designed with high levels of dissipation in mind. The aluminum material it is made from is made up of tiny pin fins that are designed to draw in air from the surrounding environment. Once the air is drawn in, it is then directed over the surface of the heat sink by the pin fins. The pin fins increase the surface area of the heat sink, which allows air to be drawn in from a larger area. This allows the heat sink to effectively and efficiently manage any heat dissipated from the component or surface it is attached to.

The air drawn in by the pin fins is then directed over the entire surface of the heat sink. The air increases the overall surface area of the material, allowing it to capture and transfer away more heat. This greatly enhances the dissipation capability of the heat sink. Additionally, the ATS-01G-46-C3-R0 has a copper base and is made with four mounting holes to ensure a secure fit.

The heat dissipated from the component is then absorbed by the aluminum material and transferred away from the component or surface. The dissipated heat is transferred away by the thermal conduction of the aluminum material itself, as well as by convection, which is the movement of air over the surface of the heat sink. This allows the ATS-01G-46-C3-R0 to effectively lower the temperature of any component or surface it is attached to.

The ATS-01G-46-C3-R0 is a highly effective thermal heat sink that is cost-effective and reliable. Its cost-effectiveness makes it a great option for those who are looking for an affordable cooling solution. Its flexible application and high levels of dissipation make it perfect for electronic equipment, amplifiers, and power supplies. Its four mounting holes also ensure that the heat sink stays firmly and securely in place.

Overall, the ATS-01G-46-C3-R0 is an exceptional thermal heat sink with a wide range of applications and excellent heat dissipation capabilities. It is cost-effective and reliable, making it an ideal choice for those in need of an effective cooling solution. Its aluminum material and pin fins make it ideal for dissipating any heat away from the surface or component it is attached to, ensuring that device or component stays safe and cool in any environment.

The specific data is subject to PDF, and the above content is for reference

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