ATS-01G-53-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.181" (30.00mm)
Width:	1.181" (30.00mm)
Diameter:	--
Height Off Base (Height of Fin):	1.181" (30.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	8.76°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Thermal - Heat Sinks have become increasingly important in the modern technological world. They provide an efficient and effective way of dissipating heat away from delicate electronic components. The ATS-01G-53-C3-R0 is a thermal solution specifically designed for a wide range of applications.
At its core, it is a passive heat transfer device that has a three-dimensionally machined structure to maximize heat dissipation. It is composed of two parts: a copper base and an aluminum radiator which uses a unique combination of controlled fin shapes to provide maximum performance.
The ATS-01G-53-C3-R0 has several features which make it a suitable solution for many thermal management applications. It has a unique fin pattern which enables the heat to be uniformly distributed throughout the heatsink, resulting in more effective temperature reduction. In addition, the fins are designed to be highly efficient in terms of their thermal resistance, resulting in a low thermal resistance across the entire heatsink.
The ATS-01G-53-C3-R0 can provide efficient thermal management for a variety of applications, including microprocessor, LED and server systems. It is capable of providing a cooling solution up to 240W for oscillators and converters. Furthermore, the ATS-01G-53-C3-R0 provides high heat flux and low thermal resistance even at low ambient temperatures. This makes it suitable for use in an industrial or commercial environment where temperature control is a must.
The working principle behind the ATS-01G-53-C3-R0 is relatively simple. In essence, it works by transferring thermal energy from the source of heat (usually a CPU or similar component) to the surrounding air. Heat from the source is absorbed by the aluminum fins of the heat sink, and is then dissipated into the air by convection. This process takes place in a linear fashion, which results in a more uniform and efficient temperature reduction.
The ATS-01G-53-C3-R0 has been designed to withstand harsh conditions, making it suitable for use in high-temperature applications. It is resistant to corrosion, and its casing is designed to protect the interior components from dust and debris. Furthermore, its unique fin design helps to reduce turbulence and noise in the affected environment. As a result, the ATS-01G-53-C3-R0 is ideal for use in a variety of industrial applications.
Overall, the ATS-01G-53-C3-R0 Heat Sink is an excellent choice for various thermal management tasks, providing an efficient and effective way of dissipating heat away from sensitivity components and protecting them from the effects of high temperatures. It is easy to install, resistant to corrosion, and capable of providing reliable performance for a variety of thermal management applications.

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