| Allicdata Part #: | ATS3990-ND |
| Manufacturer Part#: |
ATS-01G-63-C2-R0 |
| Price: | $ 4.39 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X20MM L-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-01G-63-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.99420 |
| 10 +: | $ 3.88647 |
| 25 +: | $ 3.67063 |
| 50 +: | $ 3.45467 |
| 100 +: | $ 3.23870 |
| 250 +: | $ 3.02279 |
| 500 +: | $ 2.80687 |
| 1000 +: | $ 2.75290 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 12.32°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are an important part of any electronic system, and the ATS-01G-63-C2-R0 is a high-performance thermal solution designed to help solve the problem of excess thermal energy in numerous applications, such as computers, telecoms, and industrial electronics. It is composed of two base materials, aluminum and copper, and it makes use of a patented Pressure Extruded Aluminum Technology (PEAT) to link the two metals together in perfect synchronization. This ensures consistent and reliable heat dissipation capability, as the copper base acts as a solid conductor of the thermal energy, while the aluminum structure provides a large surface area for maximum cooling. As such, the ATS-01G-63-C2-R0 offers an easy and efficient way to keep any electronic components running at optimal temperatures.
The working principle of the ATS-01G-63-C2-R0 is quite simple. It works by transferring thermal energy from a hot component into the aluminum structure of the heat sink. This structure then absorbs the thermal energy, which is then dissipated throughout its large surface area. Thanks to the efficiency of the aluminum structure, the thermal energy is rapidly dissipated, and the component is kept at a cooler temperature. This prevents the component from overheating and being damaged, thus allowing for improved performance and life span.
The ATS-01G-63-C2-R0 is a versatile heat sink with a wide range of applications, and it can be used in many different types of electronic systems. For example, it can be used in computer systems to reduce the temperature of components such as CPUs, GPUs, and other components that generate heat during operation. It can also be used in telecoms to dissipate the thermal energy generated by transceivers, base stations, and other radio communication equipment. Furthermore, the ATS-01G-63-C2-R0 can be used in industrial electronics for the same purpose.
Due to its high performance and reliability, the ATS-01G-63-C2-R0 is an ideal choice for any application requiring efficient thermal management. The patented Pressure Extruded Aluminum Technology (PEAT) ensures a consistent and reliable performance, while the large surface area of its aluminum structure guarantees optimal cooling performance. In addition, the heat sink is extremely easy to install, and it has a long lifespan, making it an ideal solution for any type of electronic system.
The specific data is subject to PDF, and the above content is for reference