ATS-01G-83-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-01G-83-C1-R0-ND

Manufacturer Part#:

ATS-01G-83-C1-R0

Price: $ 3.79
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 30X30X30MM R-TAB
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-01G-83-C1-R0 datasheetATS-01G-83-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.44736
30 +: $ 3.35433
50 +: $ 3.16802
100 +: $ 2.98166
250 +: $ 2.79531
500 +: $ 2.70213
1000 +: $ 2.42260
Stock 1000Can Ship Immediately
$ 3.79
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.181" (30.00mm)
Width: 1.181" (30.00mm)
Diameter: --
Height Off Base (Height of Fin): 1.181" (30.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 8.52°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Heat sinks are an essential part of any thermal management system and play an important role in effective heat dissipation from a variety of sources. Heat sinks are typically used in electronic components, such as processors and graphic cards, to help maintain temperatures at acceptable levels. ATS-01G-83-C1-R0 is a type of heat sink that has myriad applications in various industries. This article will discuss its application field and working principle in detail.

The ATS-01G-83-C1-R0 heat sink is a robust and multi-functional heat dissipating system with a number of benefits for many applications. It is made from high-grade aluminum material and provides superior heat dissipation efficiency in extreme temperature environments. This heat sink has a built-in thermal conductor made of up to six fins which helps regulate hot air and disperse heat to ensure optimum thermal management and cooling performance. These fins are comprised of extruded aluminum, which provides greater heat transfer efficiency than conventional designs.

The ATS-01G-83-C1-R0 heat sink is designed to provide reliable cooling solutions for a variety of applications. This heat sink is commonly used in communication equipment, such as routers and modems, as well as medical and industrial equipment. It can also be used in electronic and automotive applications, where high thermal efficiency is required. As the ATS-01G-83-C1-R0 heat sink has a low thermal resistance, it is ideal for applications which require precise temperature control and efficient cooling.

The ATS-01G-83-C1-R0 heat sink has a unique design which combines effectiveness with an attractive aesthetic design. This allows it to be used in high-profile installations such as computer systems, automobiles, or aerospace applications. Its design also provides superior heat dissipation capabilities, which greatly reduce the risk of component failure due to overheating.

The ATS-01G-83-C1-R0 heat sink works by drawing heat away from the source and dispersing it into the surrounding medium via the fins. This reduces the temperature of the source material, which in turn reduces the amount of energy required to cool the source. As the thermal resistance and convection rate of the fins are improved, heat is dissipated more quickly and efficiently.

In conclusion, the ATS-01G-83-C1-R0 heat sink is a versatile and highly effective thermal management solution for a variety of applications. Not only does it provide superior heat dissipation capabilities, but its attractive design allows it to be used in high-profile installations. The fins of the heat sink are designed to maximise heat dissipation efficiency, while its low thermal resistance ensures accurate temperature control and long-lasting reliability. With these features, the ATS-01G-83-C1-R0 heat sink is an ideal solution for effective heat dissipation across many applications.

The specific data is subject to PDF, and the above content is for reference

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