| Allicdata Part #: | ATS-01G-96-C3-R0-ND |
| Manufacturer Part#: |
ATS-01G-96-C3-R0 |
| Price: | $ 4.77 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X35MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-01G-96-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.29156 |
| 30 +: | $ 4.05279 |
| 50 +: | $ 3.81452 |
| 100 +: | $ 3.57607 |
| 250 +: | $ 3.33766 |
| 500 +: | $ 3.09926 |
| 1000 +: | $ 3.03966 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.378" (35.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 5.73°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is an important factor for proper operation of all electronic systems. Heat sinks, with their ability to dissipate heat, are one of the most commonly used components in electronic systems. The ATS-01G-96-C3-R0 is a heat sink designed to provide heat dissipation in high power applications.
The ATS-01G-96-C3-R0 is a ribbed aluminum heat sink designed for use in applications where high thermal dissipation and low thermal resistance are required. It features a low profile design that can be mounted onto circuit boards, as well as an easy clip-on feature for a secure, tight fit. The ATS-01G-96-C3-R0 is capable of dissipating up to 97W of heat and is constructed with high quality aluminum for maximum durability.
The ATS-01G-96-C3-R0 has a wide variety of application fields, such as in the automotive industry, consumer electronics, and power electronics systems. In automotive applications, the heat sink can be used to cool transistors, diodes, power modules, and other components. In consumer electronics, the heat sink can provide thermal management for a variety of components, including heat-sensitive components such as microprocessors and memories.
The ATS-01G-96-C3-R0 provides superior thermal management compared to other heat sinks due to its unique design and construction. Its low profile allows it to be mounted onto circuit boards with minimal space requirements, which makes it ideal for applications where space is limited. Its ribbed aluminum construction is highly efficient at dissipating heat and its clip-on feature ensures that it remains securely attached.
The working principle of the ATS-01G-96-C3-R0 can be summarized as follows: heat from hot components is transferred to the heat sink through thermal conduction. Heat is then dissipated away from the component by convection, as air is drawn through the fins of the heat sink. The high efficiency of the ribbed aluminum construction ensures a low thermal resistance, which in turn allows for a more effective heat transfer.
In summary, the ATS-01G-96-C3-R0 is a highly efficient heat sink designed for high power applications. It is suitable for a wide range of applications, including automotive, consumer electronics, and power electronics systems, and provides superior thermal management with its low profile design and high efficiency construction. Its working principle is simple yet effective, as heat is transferred from components, dissipated by convection, and then drawn away by air passing through the heat sink\'s fins.
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