ATS-01H-10-C3-R0

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management is an important part of many industrial application areas and is crucial in maintaining a steady operating environment for delicate electronics. Heat sinks are an integral part of many of these thermal management solutions, allowing heat to be dissipated from sensitive components while preventing damage from occurring. The ATS-01H-10-C3-R0 is a high performance, low profile, heat sink device designed to dissipate heat from components and provide a reliable solution for space constrained applications.

The ATS-01H-10-C3-R0’s design features a robust extruded aluminum fin structure with a black anodized finish that is designed for maximum heat dissipation. The extruded aluminum fin profile is designed for maximum heat conduction while remaining lightweight and low profile, thereby enabling installation into space constrained applications. The design also features built-in side mounting flanges which allows for easy installation onto a PCB. This allows for higher efficiency designs due to greater area coverage of the PCB for heat dissipation. The black anodized finish also ensures increased wear resistance and maximizes the longevity of the device.

The ATS-01H-10-C3-R0 is an excellent choice for applications that require efficient heat dissipation. The device is ideal for cooling high power electronics such as microprocessors, ASICs, FPGAs, power amplifiers, and power transistors. Additionally, the device can also be used for cooling of motor drivers and other sensitive components that require high thermal performance. The thermal design of the device is such that it can efficiently handle up to 75W of heat and can easily dissipate up to 150W of heat, depending on the application.

The ATS-01H-10-C3-R0 is designed to provide optimal performance in terms of both thermal and acoustic characteristics. This is accomplished through strategically placed ventilation holes which allow for efficient air circulation and ensure that the device operates within specified thermal tolerances. Additionally, the design also features robust rubber dampers which help reduce noise levels from the device and provide better acoustic quality. This makes it especially useful for applications in noise sensitive settings such as broadcast studios, medical facilities, and the IT industry.

The ATS-01H-10-C3-R0 is a premium-quality heat sink device that is ideal for cooling of sensitive electronics in space constrained applications. The device features an extruded aluminum fin profile for maximum heat dissipation and an optimized thermal design that provides optimal performance in terms of both thermal and acoustic characteristics. The device is suitable for applications such as microprocessors, ASICs, FPGAs, power amplifiers, and power transistors and is an excellent choice for cooling high power electronics in applications where space is limited.

The specific data is subject to PDF, and the above content is for reference