ATS-01H-100-C1-R0

Thermal management is an important aspect of modern electronic systems. In order to manage heat created by these systems, proper use of thermal heat sinks is necessary. The ATS-01H-100-C1-R0 thermal heat sink is designed to tackle the large amount of heat generated in today’s high-power electronic systems with short-term overload capability.

The ATS-01H-100-C1-R0 thermal heat sink is designed to provide efficient, reliable thermal management. It is made of high-efficiency aluminum materials that feature low thermal impedance to ensure proper heat transfer from the system to the heat sink. The device also includes a large base area to maximize passive cooling surface area for increased efficiency in heat dissipation. The heat sink also features a perforated aluminum side walls that aid in providing increased surface area for maximum heat transfer. The device is designed to be used with an appropriate fan assembly, allowing for active cooling for short-term overloads.

The ATS-01H-100-C1-R0 thermal heat sink is suitable for applications in high-power electronic systems, such as computer systems, communications equipment, and power electronics equipment. The device is capable of dissipating temperatures of up to 200°C, and is suitable for use in applications with operating temperatures of up to 300°C. The device is also designed for short-term overloads, making it an ideal choice for applications that require short-term higher power requirements.

The ATS-01H-100-C1-R0 thermal heat sink is designed to have a maximum efficiency in heat dissipation. It has a large surface area that allows for maximum passive cooling efficiency, and its aluminum side walls are designed for maximum surface area for improved heat transfer. The device is also designed for use with a suitable fan assembly to provide additional active cooling, which is critical for short-term, larger power systems.

Overall, the ATS-01H-100-C1-R0 thermal heat sink is an effective solution for high-power electronic systems that require efficient thermal management. Its large base area and perforated aluminum side walls provide improved surface area for maximum heat transfer, while its ability to utilize an appropriate fan assembly allows for improved active cooling for short-term overloads. The device is suitable for applications with operating temperatures of up to 300°C and is capable of dissipating temperatures of up to 200°C.